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Combined type cold plate

A combined, cold plate technology, applied in cooling/ventilation/heating transformation, decoration by conduction heat transfer, lighting and heating equipment, etc., can solve the problems of limited use environment, limited heat dissipation effect, and low applicability, etc. Achieve the effect of accelerating liquid return, promoting gas-liquid circulation, and facilitating replacement and maintenance

Active Publication Date: 2018-08-03
BEIJING LEAGUESUN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The heat dissipation method of the heat sink in the condensing section of the flat heat pipe is an important factor affecting the overall heat dissipation efficiency of the flat heat pipe. At present, the commonly used methods include metal heat conduction, fin air cooling, and immersion water cooling, among which metal heat conduction and fin air cooling are not only heat dissipation The effect is limited, and the applicability is not high when there are special requirements on the weight of the equipment or the space is limited
The water-cooled type can provide a large temperature difference and enhance the heat dissipation effect, but the impregnated form not only limits the use environment, but also has certain pollution

Method used

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Embodiment Construction

[0037] The present invention will be further described in detail below in conjunction with the accompanying drawings, so that those skilled in the art can implement it with reference to the description.

[0038] It should be noted that, in the description of the present invention, the terms "horizontal", "vertical", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, and It is not to indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, or operate in a particular orientation, and thus should not be construed as limiting the invention.

[0039] like Figure 1~4 Shown, the present invention provides a k...

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Abstract

The invention discloses a combined type cold plate. The combined type cold plate comprises a liquid-cooled plate and a flat heat pipe. The cross section of the liquid-cooled plate is in a U shape. Atleast one snakelike coolant passage is arranged in each of two opposite wall plates of the liquid-cooled plate, and at least one liquid inlet hole and at least one liquid discharging hole are formed on one side, away from the wall plates, of a liquid-cooled plate bottom plate connected with the two opposite wall plates of the liquid-cooled plate. One end of each of the snakelike coolant passages communicates with one of the liquid inlet holes, and the other end of each of the snakelike coolant passages communicates with one of the liquid discharging holes. The condensation end of the flat heatpipe is embedded into the sunk portion of the liquid-cooled plate. The combined type cold plate combines the advanced flat heat pipe heat dissipation technology and water cooling heat dissipation technology, and greatly improves the heat exchange performance of the heat pipe.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic equipment. More specifically, the present invention relates to a modular cold plate. Background technique [0002] With the rapid development of electronic technology, electronic components tend to be miniaturized, and the integration level continues to increase, resulting in a rapid increase in heat flux density. The traditional air cooling can no longer meet the heat dissipation requirements, and the heat dissipation effect of the pure water cooling method is becoming less and less effective. Ideally, how to achieve efficient heat dissipation of electronic equipment and ensure the reliability of electronic components is one of the current research hotspots. The flat heat pipe can quickly expand the concentrated heat source into a uniform surface heat source through the phase change and gas-liquid conversion of the internal working fluid, which not only improves the heat dissipation...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04H05K7/20
CPCF28D15/04F28D15/046H05K7/2039
Inventor 孙晓峰吕云高肃钧赵健勇王晨马学仁
Owner BEIJING LEAGUESUN ELECTRONICS
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