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Resin composition and low-gummosis prepreg prepared from resin composition

A resin composition and resin curing technology, applied in the field of low-flow glue prepreg, can solve the problems of insufficient adhesive force, large amount of glue overflowing from the prepreg, and influence of the prepreg, and achieve the effects of good stability, control and storage.

Inactive Publication Date: 2018-08-03
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the existing low-flow adhesive sheet solves the problem of insufficient cohesive force, it still has the problem of insufficient toughness, the problem of shearing off the powder and the problem of excessive glue overflow, which has caused serious problems for the application of prepregs with low resin fluidity. seriously affected
For another example, the Chinese invention patent application CN107286583A discloses the use of flexible long carbon chain high molecular weight resins for epoxy resins, but it is found in practical applications that the prepregs prepared according to the above technical solutions still have partial glue overflow during actual use. Big problem, can not meet the actual application needs

Method used

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  • Resin composition and low-gummosis prepreg prepared from resin composition
  • Resin composition and low-gummosis prepreg prepared from resin composition
  • Resin composition and low-gummosis prepreg prepared from resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0061] In a dry three-necked flask equipped with a stirrer, a thermometer and a reflux condenser, add 400 g (4.65 mol) of vinyl acetate after purification, 0.1 g AIBN and 250 mL of acetone, and heat in a water bath under stirring, controlling the temperature of the water bath to be 50- Keep reflux at 65°C; after a period of time, the reactant in the flask becomes viscous and accompanied by bubbles. When the bubbles in the reactant basically no longer rise and become thin strips, add 250mL acetone to the flask And continue to stir, stop the reaction when the viscosity of the mixture in the flask is almost constant. The mixture in the flask was poured out, washed with water, filtered, and then dried in a constant temperature oven at 100°C for 12 hours to obtain a vinyl acetate polymer. Then, get this copolymer 100g, use 100mL acetone to dissolve and pour in the flask and keep stirring, then add 150mL methanol and NaOH methanol solution 50mL, make the polyvinyl alcohol (PVA) solu...

Synthetic example 2

[0063] In a dry three-necked flask equipped with a stirrer, a thermometer and a reflux condenser, add 400 g (4.65 mol) of vinyl acetate after purification, 0.1 g AIBN and 250 mL of acetone, and heat in a water bath under stirring, controlling the temperature of the water bath to be 50- 55°C, keep reflux. After a period of time, the reactant in the flask began to become viscous and was accompanied by the generation of bubbles. When the bubbles in the reactant basically stopped rising and became long and thin, add 250mL of acetone to the flask and continue to stir. Stop the reaction when the viscosity of the mixture is almost constant. The mixture in the flask was poured out, washed with water, filtered, and then dried in a constant temperature oven at 100°C for 12 hours to obtain a vinyl acetate polymer. Then, get this copolymer 100g, use 100mL acetone to dissolve and pour in the flask and keep stirring, then add 100mL of 150mL methanol and 2mol / l hydrochloric acid, make polyv...

Embodiment 1-8 and comparative example 1-6

[0067] According to the formula shown in Table 1 and Table 2, mix the components evenly to make a 50% resin solution, use electronic grade 2116 glass fiber cloth as a reinforcing material to impregnate the above resin solution, and then heat and cure the prepreg in an oven for a certain time Low-flow adhesive prepregs can be obtained in a short period of time. Part of the prepregs are pressed into laminates according to the following conditions, and then the properties of the prepregs and laminates are evaluated by the following methods.

[0068] Prepreg and laminate production conditions:

[0069] Prepreg semi-curing conditions: 170°C / 4min for Examples 1-8 and Comparative Examples 1, 3, 5, and 6, 180°C / 4min for Comparative Examples 2 and 4; stack: 5*2116; copper foil Thickness: 1OZ; plate thickness after forming: 0.5mm; curing conditions: temperature rise 3-5°C / min, material temperature 190°C / 1-2h.

[0070] Prepreg test items: overflow glue amount, punching edge quality, pow...

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PUM

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Abstract

The invention discloses a resin composition. The resin composition is prepared from organic solid matters in parts by weight: (A) 50 to 100 parts of epoxy resin; (B) 1 to 30 parts of flexible long-chain resin; (C) 2 to 100 parts of epoxy resin curing agent; (D) 0.1 to 100 parts of flexible long-chain resin curing agent, wherein the flexile long-chain resin contains 2 hydroxyl functional groups ormore; the flexible long-chain resin curing agent is selected from one or more of isocyanate, modified isocyanate, an isocyanate end-terminated polyurethane pre-polymer, an isocyanate end-terminated organic silicon pre-polymer, boric acid and borax. The resin composition disclosed by the invention can form a flexible long-chain resin crosslinking system at a gummosis phase of curing of an epoxy curing system, so that a whole resin composition system has a very low gummosis amount; the problems in the prior art that the toughness of a prepreg is not enough and powder falls off in a cutting process, and the gummosis amount is slightly great are solved.

Description

technical field [0001] The invention relates to a resin composition and a low-flow adhesive prepreg prepared by using the resin composition, which belongs to the technical field of electronic materials. Background technique [0002] At present, rigid-flex printed circuit boards and stepped boards are currently in demand and developing printed circuit boards. This type of special printed circuit board is an effective means to achieve miniaturization and high density in the interconnection field and improve safety performance. [0003] Existing special printed circuit boards such as rigid-flex boards use low-flow resin prepregs as bonding layer materials during processing and manufacturing. Die-cut, then laminated with rigid and flexible printed boards and then pressed. Compared with conventional FR-4 prepregs, low resin fluidity prepregs have little or no glue flow under high temperature and high pressure, but still have good adhesion, and can bond the dielectric materials i...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/06C08L29/04C08L9/02C08L71/12C08K5/3445
CPCC08L63/00C08L2201/02C08L2201/08C08L2205/025C08L2205/035C08L61/06C08L29/04C08L9/02C08L71/123C08K5/3445
Inventor 何继亮马建崔春梅陈诚张明军罗鹏辉
Owner SHENGYI TECH SUZHOU
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