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Mask plate and preparation method thereof

A mask and motherboard technology, which is applied in gaseous chemical plating, liquid chemical plating, coating, etc., can solve the problems of scratching the coating substrate, the need for further research on the mask, and the increase of surface roughness.

Active Publication Date: 2018-06-22
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current metal mask is mostly Invar alloy (iron-nickel alloy), but the surface roughness will continue to increase during the cleaning process, and there will be undesirable phenomena such as scratches on the coated substrate.
[0003] Therefore, the research on the mask plate needs to be in-depth

Method used

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  • Mask plate and preparation method thereof
  • Mask plate and preparation method thereof

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Embodiment Construction

[0023] Embodiments of the present invention are described in detail below. The embodiments described below are exemplary only for explaining the present invention and should not be construed as limiting the present invention. If no specific technique or condition is indicated in the examples, it shall be carried out according to the technique or condition described in the literature in this field or according to the product specification. The reagents or instruments used were not indicated by the manufacturer, and they were all commercially available conventional products.

[0024] In one aspect of the invention, the invention provides a mask. According to an embodiment of the present invention, refer to figure 1 , the mask plate includes: a mask plate mother board 10; a protective layer 20, the protective layer 20 is arranged on at least one surface of the mask plate mother board 10 (only one surface is set as an example in the figure), and the protective layer is used for ...

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Abstract

The invention provides a mask plate and a preparation method thereof. The mask plate comprises a mask plate mother board and a protection layer, wherein the protection layer is arranged on at least one surface of the mask plate mother board, and the protection layer is used for protecting the mask plate mother board and or a substrate in direct contact with the mask plate from being not damaged. Therefore, the mask plate can have a small surface roughness by arranging the protection layer, and the substrate which is in direct contact with the mask plate can be prevented from being scratched; the protection layer can also prevent the mask plate mother board from static electricity, and the phenomenon that the thickness of a thin film at the edge of the mask plate is not uniform caused by burning of the substrate and the edge of the mask plate are avoided; and the corrosion resistance of the mask plate can be improved, and the service life of the mask plate can be prolonged.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a mask plate and a preparation method thereof. Background technique [0002] Chemical vapor deposition (CVD) is the most widely used technique in the semiconductor industry to deposit a variety of materials, including a wide range of insulating materials, most metal materials and metal alloy materials, that is, two or more gaseous raw materials are introduced into Into a reaction chamber, and then they chemically react with each other to form a new material, which is deposited on the substrate surface. In order to achieve coating in a specific area, a layer of mask is generally covered on the surface of the coating substrate, and the selective deposition of coating is realized through the non-mask area on the mask. Most of the current metal masks are Invar alloy (iron-nickel alloy), but the surface roughness will continue to increase during the cleaning process, and there will ...

Claims

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Application Information

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IPC IPC(8): C23C16/04C23C18/36C09D127/18C09D161/16C09D181/02C09D7/61
CPCC08K2003/3009C09D127/18C23C16/042C23C18/36C08L61/16C08L81/02C08K3/30
Inventor 齐忠胜李杰威殷川熊先江毛波
Owner BOE TECH GRP CO LTD
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