Formula and production process of high molecular weight corrosion-resistant epoxy vinyl ester resin
An epoxy vinyl ester, high molecular weight technology, applied in the field of high molecular polymers, can solve the problems of toughness, surface air-drying and alkali corrosion resistance, resin curing linear shrinkage rate, liquid resin thixotropic index is not ideal, etc. Excellent hydrolytic stability, good surface air-drying, excellent alkali resistance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0038] E-51 or E-44 phenol A epoxy resin 100
[0039] Acrylic 26.5
[0040] Fumaric Acid 6.0
[0041] Toluene diisocyanate 11.5
[0042] Styrene 145
[0043] P-phenol 0.105
[0044] Catalyst A: Benzyldimethylamine 0.99
[0045] Catalyst B: organotin (C 4 h 9 ) 2 Sn(OOCC 11 h 23 ) 2 0.79
[0046] Operate the production according to the steps shown in the above-mentioned production method.
Embodiment 2
[0048] E-51 bisphenol A epoxy resin 100
[0049] Acrylic 29
[0050] Fumaric acid 7.4
[0051] Toluene diisocyanate 7.5
[0052] Styrene 133
[0053] p-phenol 0.022
[0054] Catalyst A: Tetramethylammonium chloride 0.70
[0055] Catalyst B: organotin (C 4 h 9 ) 2 SnO 0.26
[0056] Operate the production according to the steps shown in the above-mentioned production method.
Embodiment 3
[0058] E-44 bisphenol A epoxy resin 100
[0059] Acrylic 20.6
[0060] Fumaric acid 8.9
[0061] Toluene diisocyanate 7.4
[0062] Styrene 125
[0063] p-phenol 0.052
[0064] Catalyst A: benzyltrimethylammonium chloride 0.35
[0065] Catalyst B: Organotin C 4 h 9 SnOOH 0.79
[0066] Operate the production according to the steps shown in the above-mentioned production method.
PUM
Property | Measurement | Unit |
---|---|---|
hardness | aaaaa | aaaaa |
thixotropic index | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com