Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat-dissipation dust collection device for computers and information engineering

It is a technology of information engineering and dust removal device, which is applied in computing, instruments, electrical and digital data processing, etc. It can solve the problems of cumbersome cleaning and disassembly process, poor heat dissipation and dust removal effect, etc., so as to reduce the number of unpacking and cleaning and the difficulty of cleaning. , Improve the heat dissipation effect and reduce the effect of dust deposition

Inactive Publication Date: 2018-06-12
蒋文婷
View PDF0 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on the cumbersome process of cleaning and disassembling the dust accumulated in the chassis and the technical problems of poor heat dissipation and dust removal effect, the present invention proposes a heat dissipation and dust removal device for computer and information engineering

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat-dissipation dust collection device for computers and information engineering
  • Heat-dissipation dust collection device for computers and information engineering
  • Heat-dissipation dust collection device for computers and information engineering

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0025] refer to Figure 1-5 , a heat dissipation and dust removal device for computer and information engineering, comprising a case 1, a card slot is opened on one side of the outer wall of the case 1, and a front cover 2 is fixed on the inner wall of the card slot by screws, and a second outer wall is opened on the other side of the case 1 Two card slots, and the inner wall of the second card slot is fixed with a backplane 9 by screws, the top outer wall of the cabinet 1 is welded with a convection box 6, and the four corners of the bottom outer wall of the cabinet 1 are fixed with support pads 12 by screws, one part of the cabinet 1 The bottom of the side outer wa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of computers and information engineering, and particularly relates to a heat-dissipation dust collection device for computers and information engineering.For solving the technical problems that cleaning of accumulated dust in a case and a case assembling and disassembling process are complicated, and heat-dissipation dust collection effects are poor, the scheme includes that the heat-dissipation dust collection device for computers and information engineering comprises a case, a slot is formed in the outer wall of one side of the case, a front cover plate is fixed on the inner wall of the slot through a screw, a second slot is formed in the outer wall of the other side of the case, and a back plate is fixed on the inner wall of the second slotthrough a screw. By a partition on a side cover plate, every important portion is sealed, with the aid of a convection fan, accumulated dust is pressed to a dust storage box by convection, and cannotbe deposited in the case, a central fixing column and a speedy fixing nut cooperate with clamped connection of a sealing clamping strip and the side cover plate, speedy assembling and disassembling can be implemented, air cooling cooperates with water cooling to improve a heat dissipation effect, a filter element is arranged at the position of a convection hole, and the accumulated dust is filtered while convection heat dissipation is implemented.

Description

technical field [0001] The invention relates to the technical field of computer and information engineering, in particular to a heat dissipation and dust removal device for computer and information engineering. Background technique [0002] With the popularity of computers, computers have become the best tool for people to integrate communication, office and entertainment. The mainframe of the computer tends to heat up after a long time of work, causing the computer to respond slowly or even crash. In the field of computer accessories, the chassis is used as the main engine One part, its main function is to place and fix various accessories of the mainframe, and play a supporting and protective role. The heat dissipation of the existing computer mainframe chassis is made of metal material, and the heat dissipation performance is poor. Due to the cooling fan, the operation of the fan will inevitably lead to air flow, and the dust in the air will enter the chassis with the air...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/182G06F1/183G06F1/20
Inventor 蒋文婷张琴陈海浪曹梦雪史丹徐婷婷黄敏骆群曙
Owner 蒋文婷
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com