Preparation method for carbon fiber-nickel-plated carbon nano-tube filled insulating aluminum substrate

Abstract

The invention discloses a preparation method for a carbon fiber-nickel-plated carbon nano-tube filled insulating aluminum substrate, and the method is characterized in that the method comprises the steps: cutting an aluminum plate into small aluminum plate blocks, grinding the small aluminum plate blocks through flint paper, washing the small aluminum plate blocks, corroding the small aluminum plate blocks in NaOH solution, corroding the small aluminum plate blocks in HNO3 solution, and carrying out the supersonic cleaning and drying; enabling carbon fibers to be immersed into acetone solution, carrying out the water bath heating, obtaining desized carbon fibers, adding concentrated nitric acid solution, carrying out the supersonic oscillation, obtaining the desized carbon fibers with theprocessed surfaces, and mixing the desized carbon fibers with a nickel-plated carbon nano-tube; wrapping copper powder, aluminium nitride and organic silica gel with graphene, carrying out the uniformmixing and kneading, putting the mixture into a die for heating and solidifying, and obtaining a graphene-coated copper powder-aluminium nitride heat conducting material after demolding; heating epoxy resin in a drying box, adding a heat conducting filling material and a heat conducting material, carrying out the mechanical stirring and supersonic oscillation, carrying out the vacuum defoamation,adding a curing agent, carrying out stirring slowly, performing vacuum pumping for several times, obtaining an unsolidified mixture, coating the processed aluminum substrate with the mixture uniformly, carrying out the curing, cooling and grinding, and obtaining an insulating aluminum substrate.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for preparing an insulating aluminum substrate filled with carbon fiber-nickel-plated carbon nanotubes. Background technique [0002] With the rapid development of electronic information technology, higher requirements are placed on the performance of printed circuit boards (PCBs) for electronic circuits. Electronic equipment that is light, thin and consumes a lot of power has been plagued by heating problems since its birth. As the bridge and carrier of each heating device, PCB has always been the focus of research on enhancing equipment heat dissipation. Substrate materials with excellent thermal conductivity and good heat dissipation structure All PCBs can evenly distribute the heat generated by the heating device, enhance the heat dissipation efficiency, and reduce the thermal damage of expensive devices. LED has the characteristics of small size, low power c...

AI Technical Summary

Problems solved by technology

At present, most LEDs are packaged in MCPCB. With the increase of chip power, the problem of device failure due to poor heat dissipation has become increasingly prominent.