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Plating bath composition for electroless plating of gold and a method for depositing a gold layer

A technology of electro-gold and compounds, applied in the direction of metal material coating process, coating, liquid chemical plating, etc., can solve the problems of lack of plating rate and stability

Inactive Publication Date: 2018-05-11
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the plating baths described therein still lack plating rate and stability (see Example 4)

Method used

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  • Plating bath composition for electroless plating of gold and a method for depositing a gold layer
  • Plating bath composition for electroless plating of gold and a method for depositing a gold layer
  • Plating bath composition for electroless plating of gold and a method for depositing a gold layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] Embodiment 1 (invention): N 1 ,N 2 -Diisopropylethane-1,2-diamine as a plating enhancer compound

[0068] Prepare a gold plating bath containing the following components by dissolving all components in water:

[0069]

[0070] The substrates were subjected to the following treatment steps by immersing them in the respective solutions with the given parameters (Table 1):

[0071] Table 1: Process steps used for gold plating

[0072]

[0073] After this process step, the thickness of the individual metal layers is measured. Plating rates were calculated as described above.

[0074] Table 2: Containing N 1 ,N 2 - Layer thickness and plating rate of gold plating baths with diisopropylethane-1,2-diamine

[0075]

[0076] The gold layer is lemon yellow. Also, the plating rate is high, well above the expected minimum of 250 nm / h. The layer thickness distribution is also very uniform with a deviation of only 5.6%.

Embodiment 2

[0077] Embodiment 2 (invention): N 1 ,N 2 -Dipropylethane-1,2-diamine as plating enhancer compound

[0078] Repeat the process described in Example 1, wherein the gold plating bath contains 50mmol / L N 1 ,N 2 -Dipropylethane-1,2-diamine instead of 50mmol / L N 1 ,N 2 - Diisopropylethane-1,2-diamine. The results are summarized in the table below:

[0079] Table 3: Contains N 1 ,N 2 - Layer thickness and plating rate of gold plating baths with dipropylethane-1,2-diamine

[0080]

[0081] The gold layer is lemon yellow. Also, the plating rate is high, above the expected minimum of 250 nm / h. The layer thickness distribution is also very uniform with a deviation of only 6.6%.

Embodiment 3

[0082] Embodiment 3 (invention): N 1 ,N 2 -Diethylethane-1,2-diamine as plating enhancer compound

[0083] The treatment described in Example 1 was repeated, wherein the gold plating bath contained N 1 ,N 2 -Diethylethane-1,2-diamine instead of N 1 ,N 2 - Diisopropylethane-1,2-diamine, but at the same concentration. The results are summarized in the table below:

[0084] Table 4: Containing N 1 ,N 2 - Layer thickness and plating rate of gold plating baths with diethylethane-1,2-diamine

[0085]

[0086] The gold layer is lemon yellow. Furthermore, the plating rate is high, well above the expected minimum of 250 nm / h. The layer thickness distribution is also very uniform with a deviation of only 6.4%.

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PUM

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Abstract

An electroless aqueous gold plating bath, comprising at least one source of gold ions and at least one reducing agent for gold ions, characterized in that it comprises at least one ethylenediamine derivative as plating enhancer compound according to formula (I), wherein the residues R1 and R2 comprise 2 to 12 carbon atoms and are selected from the group consisting of branched alkyl, unbranched alkyl, cycloalkyl or combinations thereof wherein the individual residues R1 and R2 are the same or different and a method of depositing of gold. The electroless aqueous gold plating bath is suitable toprovide soft gold layers useful for wire bonding and soldering applications which are required for electronic components.

Description

technical field [0001] The present invention relates to aqueous electroless gold plating bath compositions for electroless plating of gold layers onto substrates and methods of depositing gold. The plating bath is particularly suitable for the manufacture of printed circuit boards, IC substrates, semiconductor devices, interposers made of glass, and the like. Background technique [0002] Gold layers are of greatest interest in the manufacture of electronic components and in the semiconductor industry. Gold layers are often used as solderable and / or wire-bondable surfaces in the manufacture of printed circuit boards, IC substrates, semiconductor devices, and the like. Typically, they are used as a final finish prior to soldering and wire bonding. In order to provide an electrical connection with sufficient conductivity and robustness between the copper wire and the lead wire bonded thereto, while providing good strength for the wire bond, there are various layer assemblies...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16C23C18/18C23C18/44
CPCC23C18/44C23C18/1844C23C18/1637
Inventor 罗伯特·施普伦曼克里斯蒂安·内特利希萨布里纳·格伦诺瓦德米特罗·沃隆申鲍里斯·亚历山大·詹森东尼·劳坦
Owner ATOTECH DEUT GMBH
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