Ring-shaped superhard abrasive wire and manufacturing method thereof

Abstract

The invention discloses a ring-shaped superhard abrasive wire and a manufacturing method of the ring-shaped superhard abrasive wire. A base body of the ring-shaped superhard abrasive wire is a wire rope. The wire rope is connected end to end into a ring shape. Silk threads are loosely wound around the wire rope. Silk threads with abrasive are tightly wound around the exposed part of the wire ropeand the silk threads. The pitch between every two joints of adjacent silk threads on the wire rope is larger than or equal to 3 times the diameter of the silk threads with the abrasive. Every two joints of silk threads with the abrasive on the wire rope or the silk threads are sequentially arranged and not mutually pressed and stacked, and meanwhile the peripheries of every two joints of adjacentsilk threads with the abrasive are in contact with each other. The ends of the silk threads with the abrasive are buried under the winding-finished silk threads with the abrasive. The ring-shaped superhard abrasive wire has the ultra-high chipping discharge space and the higher cutting capacity, the manufacturing method is simple and easy to implement, and mass production is fast.

Description

technical field [0001] The invention relates to cutting tools for precious metals, semiconductors and non-conductors, in particular to an annular superhard abrasive wire and a manufacturing method thereof. Background technique [0002] Brittle and hard materials such as silicon, sapphire, and ceramics have high hardness and high brittleness, and are prone to chipping and damage during the cutting process, causing damage to the material and reducing the yield. Therefore, these materials are difficult to cut by ordinary processing methods. [0003] At present, diamond wire saws are usually used for cutting. In the prior art, diamond particles are usually consolidated on the surface of steel wires through resin, electrodeposition, stamping, etc. to form diamond wire saws. However, the chip space of the existing diamond wire saw is small, and it is difficult to discharge the chips when the chips fill the chip space, which leads to the inability of the wire saw to work. Content...

AI Technical Summary

Problems solved by technology

However, the chip space of the existing diamond wire saw is small, and it is difficult to discharge the chips when the chip space is filled, which leads to the inability of the wire saw to work

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