Organic light emitting diode (OLED) package method and OLED package structure
A packaging method and packaging structure technology, which is applied in the direction of organic semiconductor devices, electrical components, electrical solid devices, etc., can solve problems such as electrical drift, TFT device performance impact, and lower image display quality, achieving strong light intensity and excellent electrical properties. performance effect
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[0046] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail the preferred embodiments of the present invention and the accompanying drawings.
[0047] See figure 2 , The present invention provides an OLED packaging method, including the following steps:
[0048] Step S1, such as image 3 As shown, a TFT substrate 10 is provided, and an OLED device 30 is fabricated on the TFT substrate 10; a first passivation layer 41 covering the OLED device 30 is formed on the outer surface of the OLED device 30.
[0049] Specific, such as Figure 4 As shown, the OLED device 30 includes an anode 31, a hole injection layer 32, a hole transport layer 33, a light emitting layer 34, an electron transport layer 35, and an electron injection layer which are sequentially arranged on the TFT substrate 10 from bottom to top. 36 and cathode 37.
[0050] Specifically, the anode 31, the hole injection layer 32, the hole transport ...
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