Coating micro-drilling knife for printed circuit board machining and preparation method thereof
A printed circuit board and micro-drilling technology, which is applied in coating, metal processing, metal material coating technology, etc., can solve the problems that cannot meet the service conditions of high-speed cutting, and achieve simple operability, good adhesion, Effect of Low Coefficient of Friction
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Embodiment 1
[0028] Such as figure 1 As shown, a coated micro-drill for processing printed circuit boards includes a micro-drill substrate 1, and the micro-drill substrate 1 is sequentially attached with a metallurgical bonding layer 2, a transition layer 3, and a main resistance layer from the inside to the outside. The grinding layer 4 and the self-lubricating layer 5, the metallurgical bonding layer 2 is a pure metal Cr layer, the transition layer 3 is a nano-multilayer composed of Cr and VN alternately, and the main wear-resistant layer 4 is a nano-multilayer composed of DLC and VN alternately. The lubricating layer 5 is a Cr-doped DLC layer.
[0029] The thickness of the transition layer 3 is 100-200 nm, the thickness of the main wear-resistant layer 4 is 500-1500 nm, and the thickness of the self-lubricating layer 5 is 200-500 nm.
[0030] In the transition layer 3, the thickness of a single layer of Cr is 10-20 nm, and the thickness of a single layer of VN is 5-15 nm.
[0031] In ...
Embodiment 2
[0043] A coated micro-drill for processing printed circuit boards, comprising a micro-drill substrate, on which a metallurgical bonding layer, a transition layer, a main wear-resistant layer and a self-lubricating layer are sequentially attached from the inside to the outside, The metallurgical bonding layer is a pure metal Cr layer, the transition layer is a nano-multilayer composed of Cr and VN alternately, the main wear-resistant layer is a nano-multilayer composed of DLC and VN alternately, and the self-lubricating layer is a Cr-doped DLC layer.
[0044] The thickness of the transition layer is 100nm, the thickness of the main wear-resistant layer is 500nm, and the thickness of the self-lubricating layer is 200nm. In the transition layer, the single-layer Cr thickness is 10nm, and the single-layer VN thickness is 8nm. In the main wear-resistant layer, the single-layer DLC has a thickness of 5nm, and the single-layer VN has a thickness of 10nm.
[0045] The material of the...
Embodiment 3
[0055] A coated micro-drill for processing printed circuit boards, comprising a micro-drill substrate, on which a metallurgical bonding layer, a transition layer, a main wear-resistant layer and a self-lubricating layer are sequentially attached from the inside to the outside, The metallurgical bonding layer is a pure metal Cr layer, the transition layer is a nano-multilayer composed of Cr and VN alternately, the main wear-resistant layer is a nano-multilayer composed of DLC and VN alternately, and the self-lubricating layer is a Cr-doped DLC layer.
[0056] The thickness of the transition layer is 120nm, the thickness of the main wear-resistant layer is 600nm, and the thickness of the self-lubricating layer is 300nm. In the transition layer, the single-layer Cr thickness is 12nm, and the single-layer VN thickness is 6nm. In the main wear-resistant layer, the single-layer DLC has a thickness of 6nm, and the single-layer VN has a thickness of 9nm.
[0057] The material of the ...
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