Method for preparing nano aluminum film by radio frequency magnetron sputtering

Abstract

The invention belongs to the technical field of aluminum film preparation and discloses a method for preparing nano aluminum film by radio frequency magnetron sputtering. The method comprises the following steps: preparing an aluminum film by adopting a way of radio frequency sputtering by using a magnetron sputtering coating machine by taking an aluminum target as a sputtering target and a microscopic glass slide as a substrate; putting the substrate which is washed for 20min with absolute ethyl alcohol into a vacuum cabin, and erasing the substrate dry and putting the same onto a sample table capable of rotating; adjusting the target-substrate distance to 100mm, carrying out vacuumizing, wherein the back bottom vacuum degree of a sputtering apparatus reaches 5.0*10<-4>Pa, introducing argon, the purity of which is 99.99%, setting the argon flow at 40sccm and the temperature at the room temperature and the sputtering time at 600s; and adjusting three process parameters: negative bias,radio-frequency power and working air pressure, and discussing influence of the three process parameters on the depositing rate of the film by means of an orthogonal test. By selecting the process parameters, the aluminum film which is relatively high in depositing rate, good in film quality, relatively great in thickness and fine in grain size is designed.

Description

technical field [0001] The invention belongs to the technical field of aluminum film preparation, in particular to a method for preparing nano aluminum film by radio frequency magnetron sputtering. Background technique [0002] Since the 1970s, thin-film technology and thin-film materials have developed by leaps and bounds, and have achieved fruitful results in both academic and practical applications, and have become the most active research in contemporary vacuum science and technology and material science. It plays a pivotal role in the high-tech industry. Thin film technology and thin film materials have penetrated into various important fields of modern science and technology and the national economy. With the development of thin film science and technology and thin film physics, the application of thin films in aerospace, medicine, energy, transportation, communication and information fields is increasing. Extensive, and the growing thin film industry has stimulated t...

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Problems solved by technology

[0003] In summary, the problems existing in the prior art are: the current nano-aluminum film preparation method has poor bonding ability between the film layer and the substrate, high porosity and poor uniformity of the film, and the traditional preparation process consumes a lot of energy and has a large impact on the environment. Pollution

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