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Polyimide precursor, polyimide and manufacturing method of transparent polyimide film

A technology of polyimide precursor and polyimide film, applied in the direction of coating, etc., to achieve the effects of simple dimensional stability, excellent heat resistance, and excellent laser peeling characteristics

Active Publication Date: 2018-02-23
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the reality is that the development of a transparent polyimide film and its manufacturing method that can be used as a practical heat-resistant transparent resin substrate material that can replace glass substrates and satisfy required characteristics such as dimensional stability continues.

Method used

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  • Polyimide precursor, polyimide and manufacturing method of transparent polyimide film
  • Polyimide precursor, polyimide and manufacturing method of transparent polyimide film
  • Polyimide precursor, polyimide and manufacturing method of transparent polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0122] Under nitrogen flow, 9.17 g of TFMB were dissolved in 85 g of NMP in a 100 ml separable flask. Next, 5.00 g of CBDA was added to the solution. After stirring for 10 minutes 0.83 g of BPDA was added. In addition, the molar ratio of a diamine component and a tetracarboxylic dianhydride component was made into 0.99 (substantially equimolar). Thereafter, the solution was continuously stirred at room temperature for 24 hours to conduct a polymerization reaction to obtain polyamic acid A (a viscous colorless solution) with a high degree of polymerization (Mw 80,000 or more, viscosity 3,000 cP or more).

Embodiment 2～ Embodiment 9、 comparative example 1～ comparative example 7

[0124] Except having changed the diamine and tetracarboxylic dianhydride which are raw materials into the composition shown in Table 1 and Table 2, the polyamic-acid solution was prepared similarly to Example 1, and polyamic-acid B - polyamic-acid P were obtained.

[0125] In addition, in Table 1 and Table 2, the unit of the quantity of diamine and tetracarboxylic dianhydride is g, and the numerical value in parentheses shows the mol% in a diamine component or a tetracarboxylic dianhydride component.

[0126] [Table 1]

[0127]

[0128] [Table 2]

[0129]

Embodiment 10

[0131] Add the solvent NMP to the polyimide precursor solution A obtained in Example 1, dilute it so that the viscosity becomes 4000cP, and then use a spin coater so that the thickness of the cured polyimide becomes about 15 μm It was applied on a glass substrate (E-XG manufactured by Corning, size=150 mm×150 mm, thickness=0.7 mm). Next, heating was performed at 100° C. for 15 minutes. Then, in a nitrogen atmosphere, the temperature was raised from room temperature to 300°C (360°C in Comparative Example 10) at a certain rate of temperature rise (3°C / min), and kept at 130°C for 10 minutes in the middle, thereby forming a 150mm× 150 mm of polyimide layer (polyimide A), and polyimide laminated body A was obtained.

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Abstract

The present invention provides a polyimide precursor of a heat resistant transparent resin substrate material that is excellent in size stability, transparency and heat resistance, can be peeled froma supporting substrate to obtain a thin polyimide film, polyimide and a manufacturing method of a transparent polyimide film. The polyimide precursor has a structural unit originating from diamine, astructural unit originating from acid dianhydride, a structural unit originating from the 2,2'-bi (trifluoromethyl)-4,4'-diaminodiphenyl and a structural unit originating from the 1, 2, 3, 4-cyclobutane tetracarboxylic dianhydride. In all structural units originating from acid dianhydride, more than 70 mol% of structural units originating from 1, 2, 3, 4-cyclobutane tetracarboxylic dianhydride arecontained, and the light transmittance when carrying out the imide operation on the polyimide precursor to form the polyimide, is 5% or less at 308 nm and is 70% or more at 400 nm, and a coefficientof thermal expansion is 45 ppm / K or less.

Description

technical field [0001] The present invention relates to a transparent film material or a transparent flexible substrate material, especially useful as a transparent material having high transparency, low thermal expansion coefficient, high heat resistance, and laser lift-off characteristics. A polyimide precursor of a resin substrate material, a polyimide, and a method for producing a transparent polyimide film. Background technique [0002] With the rapid development of high-performance electronic equipment, there is a tendency to become lighter and thinner. Along with this, there is an increasing demand for components used in electronic equipment and substrates on which these components are mounted. . In applications such as displays and touch panels, glass substrates are used as base materials for display panels, but in order to achieve further reduction in thickness, weight reduction, flexibility, and roll-to-roll (Roll-to-Roll) process cost reduction Developed resin s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18
CPCC08G73/1007C08G73/1042C08G73/1075C08G73/1078C08J5/18C08J2379/08C08G73/1039C08L79/08B29C41/28C08L2201/02
Inventor 王宏远平石克文森本敏弘
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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