Method for machining quartz crystal resonator

Abstract

The invention relates to a method for machining a quartz crystal resonator. The method comprises the following steps of S1, crystal sorting: sorting quartz crystals of the same angle and concentratingthe quartz crystals together; S2, crystal cutting: cutting the quartz crystals of the same angle obtained through sorting into wafers according to requirements; S3, wafer grinding: grinding the wafers till the thickness of the wafers is consistent with a required frequency by using a grinding machine; S4, polishing: polishing the ground wafers by using a polishing machine; S5, chemical corrosion:performing chemical corrosion on the polished wafers; S6, silver plating of wafers: dividing the surface of each chemically corroded wafer into a silver plating area and a non-silver plating area, plating the silver on the silver plating area and the non-silver plating area of the wafer firstly to obtain a silver-plated layer, and then etching away the silver-plated layer of the non-silver plating area by adopting an etching method; S7, packaging and forming. The machining method is low in machining difficulty, and the cleaning by acids is not required. Meanwhile, the method is high in environment-friendly degree, and the silver material can be recovered conveniently.

Description

technical field [0001] The invention belongs to the field of electronic components, and in particular relates to a processing method for a quartz crystal resonator. Background technique [0002] Quartz crystal resonator is a piezoelectric device made of piezoelectric quartz (that is, crystal), which not only has highly stable physical and chemical properties, but also has extremely small elastic vibration loss. Compared with other electronic components, piezoelectric quartz crystals also have high frequency stability and high Q value, making them an important component for frequency stabilization and frequency selection. [0003] In the prior art, the silver plating of the wafer is usually covered with a mask on the upper wafer, the area of ​​the wafer that does not need to be silvered is covered by the mask, and the place that needs to be silvered is exposed, and then silvered. The silver process is not only difficult to process, but also produces errors in the area covere...

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Problems solved by technology

[0003] In the prior art, the silver plating of the wafer is usually covered with a mask on the upper wafer, the area of ​​the wafer that does not need to be silvered is covered by the mask, and the place that needs to be silvered is exposed, and then silvered. The silver process is not only difficult to process, but also produces errors in the area covered by the mask, resulting in low processing accuracy

In addition, after the silver plating process is completed, the mask sheet needs to be cleaned, and the general cleaning uses highly polluting acids, and the silver after cleaning is difficult to recover, and the loss rate of the silver material is high

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