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Laptop CPU (Central processing Unit) cooling module

A heat dissipation module and notebook technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of easy backflow of heat pipes, poor heat dissipation efficiency and effect, etc.

Inactive Publication Date: 2018-01-19
SUZHOU FORCECON ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the prior art, the heat dissipation pipes of heat dissipation modules are mostly bent pipes, and the wind direction is easy to flow backward in the heat dissipation pipes, resulting in poor heat dissipation efficiency and effect. The present invention solves such problems

Method used

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  • Laptop CPU (Central processing Unit) cooling module

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Embodiment Construction

[0018] The present invention will be specifically introduced below in conjunction with the accompanying drawings and specific embodiments.

[0019] Notebook CPU heat dissipation module, including: centrifugal fan 1, which is arranged on the upper end of centrifugal fan 1 and connected to the heat dissipation pipe 2 of the CPU, and the heat transfer fin 3 connected between the heat dissipation pipe 2 and the CPU, which is arranged in the direction of the wind in the heat dissipation pipe 2 The guide piece 4 and the wind direction guide piece 4 are arranged obliquely in the heat dissipation pipe 2 , and fix the centrifugal fan 1 and connect to the end cover of the heat transfer fin 3 .

[0020] Such as figure 1 As shown, there are a plurality of wind direction guide pieces 4, which are evenly distributed on the inner wall of the heat dissipation pipe 2; in order to increase the service life, when the wind blows to the wind direction guide piece 4, the guide piece has certain duc...

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Abstract

The invention discloses a laptop CPU (Central processing Unit) cooling module, which comprises a centrifugal fan, a cooling pipe, a heat transfer sheet and wind direction guidance sheets, wherein thecooling pipe is arranged on the upper end of the centrifugal fan and is connected to the CPU; the heat transfer sheet is connected between the cooling pipe and the CPU; and the wind direction guidancesheets are aslant arranged in the cooling pipe. The invention provides the laptop CPU cooling module, the wind direction guidance sheets are arranged in the cooling pipe so as to prevent a wind direction from inversely flowing in the cooling pipe, and cooling efficiency and cooling effects are improved.

Description

technical field [0001] The invention relates to an electronic component, in particular to a notebook CPU cooling module. Background technique [0002] The heat dissipation module is a module unit used for heat dissipation in systems, devices, equipment, etc., and is used in heat dissipation devices such as notebooks, desktop computers and projectors with heat pipes. [0003] Due to the internal space characteristics of notebook computers, the concept of heat exchange must be adopted to solve the problem of waste heat in the system. Therefore, the cooling device of notebook computers basically consists of a heat conduction section and a heat dissipation section; the heat pipe is responsible for rapid heat conduction in the heat conduction section. The role of the fan is to provide the airflow required for forced convection in the heat dissipation section. [0004] However, in the prior art, the heat dissipation pipes of the heat dissipation modules are mostly bent pipes, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 饶振奇赖俊男
Owner SUZHOU FORCECON ELECTRIC
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