Heat-conductive silicone grease composition being high in heat conductivity and low in viscosity, and preparation method of the silicone grease composition

Abstract

The invention discloses a heat-conductive silicone grease composition being high in heat conductivity and low in viscosity and freeness degree, and a preparation method of the silicone grease composition. The heat-conductive silicone grease composition includes organo-polysiloxane, heat conductive filler and other additives. By selecting the heat conductive fillers in multiple dimensions (one-dimension, two-dimension and three-dimension) and multiple scales (micron, submicron and nanometer) and in special ranges, synergistic effect among the multi-dimension and multi-scale fillers is achieved,thus achieving compact stack of the fillers in a local network structure. The heat-conductive silicone grease not only is improved in heat-conductivity but also has good flowability, low viscosity and low freeness degree.

Description

technical field [0001] The invention belongs to the field of thermal interface materials, and in particular relates to a thermally conductive silicone grease composition with high thermal conductivity and low viscosity and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology, the degree of integration and assembly density of electronic components has been continuously improved. While providing powerful functions, it has also led to a sharp increase in power consumption and heat generation. There are extremely fine uneven gaps between the surface of electronic components and the heat sink. If they are directly installed together, the actual contact area is only 10% of the base area of ​​the heat sink, and the rest are air gaps. Because air is a poor conductor of heat, it will lead to a very large contact thermal resistance between the electronic components and the heat sink, which seriously hinders the conduction of h...

AI Technical Summary

Problems solved by technology

The current technology only considers the effect of multi-dimensional filler compounding on the thermal conductivity of silicone grease. In most cases, the addition of one-dimensional fibers and two-dimensional sheet structures forms an overall three-dimensional network structure. Although it is beneficial to the formation of thermal conduction channels, it hinders The relative slip and flow between the fillers will lead to a sharp increase in the viscosity of the silicone grease, which will seriously reduce the operability of the product.