Superconducting quantum computing chip integrated package structure and method

Abstract

The invention discloses a superconducting quantum computing chip integrated package structure and method. The integrated package structure comprises a superconducting quantum computing chip, and a flip chip packaged together with the superconducting quantum computing chip. An insulation substrate of the superconducting quantum computing chip has a plurality of mutually-coupled superconducting quantum bits and first communication lines connected with the superconducting quantum bits and used for carrying out control and readout on the superconducting quantum bits. The flip chip has a pluralityof superconductive resonant cavities. The superconductive resonant cavities are corresponding to the superconducting quantum bits and the first communication lines, and are used for carrying out magnetic shielding on each superconducting quantum bit and each first communication line. Magnetic shielding can be carried out on each superconducting quantum bit and each first communication line, so that crosstalk between input and output leads and influence on quantum bits are reduced, de-coherence time of the quantum bits is improved, and requirement for large-scale quantum computation is reached.

Description

technical field [0001] The invention relates to the field of superconducting quantum computing, in particular to an integrated packaging structure and method for a superconducting quantum computing chip. Background technique [0002] Quantum computers use the basic principle of quantum mechanics, the superposition of quantum states, to achieve information processing tasks that are difficult for classical computers to complete. In the current research, because it is compatible with the current very mature traditional silicon integrated circuit processing technology, the device parameters can also be well and accurately controlled during the design, processing and preparation process, and can be integrated, using superconducting qubits Superconducting quantum computing is one of the most promising solutions for building quantum computers. [0003] How to maintain the quantum nature of qubits, that is, maintain their coherence, and at the same time be able to regulate specific...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above-mentioned technical problems, the present invention provides an integrated packaging structure and method for a superconducting quantum computing chip to solve the problem of the interaction between multiple superconducting qubits on the superconducting quantum computing chip and the input and output circuits. role problem

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