Polyimide film with pyrimidine side groups and preparation method of polyimide film
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The technology of polyimide film and polyamic acid is applied in the field of polyimide film with pyrimidine side group and its preparation field, which can solve the problems of high rigidity of molecular chain, low elongation at break, poor flexibility, etc. Effects of high modulus, reduced bulk density, and increased elongation at break
Active Publication Date: 2017-11-24
JIANGHAN UNIVERSITY
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[0003] However, among the polyimide materials that have been reported, the polyimide polymer used as a flexible display substrate material has excellent thermal stability and tensile strength, but its molecular chain rigidity makes the material brittle and fractures. Low elongation, poor flexibility
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Embodiment 1
[0043] At -15°C, p-phenylenediamine (10.8g, 0.1mol) and N-(2-pyrimidinyl)-2-(3-aminophenyl)-5-aminoindole (15.05g, 0.05mol) Dissolve the mixed diamine in 180g of strictly dry NMP, protect it under nitrogen, stir it mechanically until it is completely dissolved, and then add aromatic dianhydride {(aromatic dianhydride is a commercially available product), and the aromatic dianhydride is selected from 1, 2, 4 , 5-Pyromellitic dianhydride, the addition amount is (32.7g, 0.15mol) Continue stirring for 18h under the protection of nitrogen to obtain a polyamic acid solution.
[0044] After decompressing the above polyamic acid solution to eliminate air bubbles, apply it on clean glass with a film thickness of 150 microns, put it in an oven, and heat it to cure at 80°C for 360 minutes, 170°C for 60 minutes, and 230°C for 60 minutes. Cured at 300°C for 120 minutes, evaporated to remove the solvent, then cooled down to room temperature naturally, and peeled off to obtain a film.
Embodiment 2
[0045] Embodiment 2: In the implementation process, except that the aromatic dianhydride is selected from 3,3'-4,4'-biphenyl dianhydride, and its addition amount is different (44.1g, 0.15mol), the rest are the same as in Example 1.
Embodiment 3
[0046] Embodiment 3: In the implementation process, except that the aromatic dianhydride is selected from 3,3'-4,4'-diphenyl ether dianhydride, and its addition amount is different (46.5g, 0.15mol), the rest are the same as in Example 1.
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Abstract
The invention discloses a polyimide film with pyrimidine side groups and a preparation method of the polyimide film. The preparation method comprises the following steps: 1) mixing aromatic diamine with diamine containing an N-pyrimidinyl indole structure under protection of nitrogen or argon to form mixed diamine, and dissolving the mixed diamine in a polar solvent completely at the temperature of subzero 15 DEGC-100 DEG C to obtain a mixed solution; 2) adding aromatic dianhydride to the mixed solution, and performing a reaction for 5-24 h by keeping the temperature of a reaction system at subzero 15 DEGC-100 DEG C to obtain a polyamide acid solution; 3) forming a film from the polyamide acid solution through flow casting or blade coating on a glass substrate, increasing temperature in a programming manner for thermal imidization, reducing the temperature naturally to room temperature after a heating program is finished, and performing stripping to obtain the polyimide film with the pyrimidine side groups. By introducing pyrimidine rings into polyimide, the packing density of molecular chains is reduced, material flexibility is improved, and the prepared polyimide film with the pyrimidine side groups has high heat resistance, dimensional stability and flexibility and can be used as a flexible display substrate material.
Description
technical field [0001] The invention relates to the technical field of polymer materials, in particular to a polyimide film with pyrimidine side groups and a preparation method thereof. Background technique [0002] Polyimide is a high-performance polymer material with excellent chemical stability, thermal stability and high mechanical strength, and has been widely used in aerospace, microelectronics and chemical industries. In recent years, the research on the use of polyimide thin films as flexible display substrate materials has attracted much attention. The substrate material used for top-emitting flexible displays does not require colorless and transparent, but the high-temperature display process requires polyimide to be extremely high-temperature resistant, and the substrate is required to be flexible and resistant to bending. [0003] However, among the polyimide materials that have been reported, the polyimide polymer used as a flexible display substrate material h...
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