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Efficient graphene nano-modified heat dissipation material and preparation method thereof

A nano-modification and heat dissipation material technology, applied in the field of heat dissipation materials, can solve the problems of increased processing difficulty, poor dispersion, and inability to show the excellent characteristics of graphene, and achieve the effect of wide application and low interface thermal resistance

Active Publication Date: 2018-08-17
厦门科一新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although graphene and polymer nanocomposites have a large number of research reports because of their excellent various properties, they have attracted widespread attention in the scientific and industrial circles, but the easy stacking characteristics of graphene lead to poor dispersion. And the difficulty of post-processing increases, so that the excellent characteristics of graphene cannot be shown

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  • Efficient graphene nano-modified heat dissipation material and preparation method thereof
  • Efficient graphene nano-modified heat dissipation material and preparation method thereof

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preparation example Construction

[0025] The present invention provides a kind of preparation method of high-efficiency graphene nano-modified heat dissipation material, and it comprises following process:

[0026] Step 1: Prepare graphene: prepare by Hummers method and thermal reduction method, first prepare graphene oxide by Hummers method, and thermally reduce graphene oxide to graphene.

[0027] The preparation of graphene oxide by the Hummers method comprises the following steps: Low-temperature reaction: put a dry container (such as a large beaker) in an ice-water bath, add 98% concentrated sulfuric acid (H 2 SO 4 ) 110mL, turn on the cooling circulation pump to keep the temperature of the container at -1°C-1°C, slowly add 5g of flake graphite (-100 mesh) while stirring, continue stirring, and slowly add 2.5g of sodium nitrate (NaNO 3 ), continue to stir for about 30min, then slowly add potassium permanganate (KMnO 4 ) 15g, continue to stir (1.5 hours - 2 hours) to make it fully react, and the solution...

Embodiment 1

[0049] The following is a specific embodiment to illustrate the graphene nano heat dissipation material: 15 parts of graphene, 3 parts of graphene oxide and 6 parts of nano ceramics (Al 2 o 3 The weight: the weight of aluminum nitride = 5: 3) The graphene nano-modified powder is prepared by the preparation method in step 4, wherein the first solvent used is N,N-dimethylformamide; the graphene nano 6 parts of modified powder, 60 parts of second solvent, 55 parts of high molecular polymer and 10 parts of additives are obtained by ultrasonic blending to obtain graphene nano-heat dissipation material, wherein the content of graphene nano-modified powder is 4.58wt% ( Graphene nano-modified powder / (graphene nano-modified powder + second solvent + polymer + additive) = 4.58%), where the second solvent used is N,N-dimethylformamide , the high molecular polymer is HDPE, and the additive is used to assist in forming the coating, and the additive in this embodiment is a defoamer and a...

Embodiment 2

[0054]The following is another specific embodiment to illustrate the graphene nano heat dissipation material: 20 parts of graphene, 4 parts of graphene oxide and 8 parts of nano ceramics (Al 2 o 3 The weight: the weight of aluminum nitride = 5: 3) The graphene nano-modified powder is prepared by the preparation method in step 4, wherein the first solvent used is N,N-dimethylformamide; the graphene nano 7 parts of modified powder, 75 parts of second solvent, 65 parts of high molecular polymer and 10 parts of additives are obtained by ultrasonic blending to obtain graphene nano-heat dissipation material, wherein the content of graphene nano-modified powder is 4.46wt% ( Graphene nano-modified powder / (graphene nano-modified powder + second solvent + polymer + additive) = 4.46%), wherein the second solvent used is N-methylpyrrolidone, polymer polymer The material is PET, and the additive is used to assist in forming the coating, and the additive in this embodiment is a defoamer an...

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Abstract

The invention discloses an efficient graphene nanometer modified heat-radiating material and a preparation method thereof. The efficient graphene nanometer modified heat-radiating material contains the following components in parts by weight: 5-10 parts of graphene nanometer modified powder, 55-80 parts of second solvent, 50-70 parts of high-molecular polymer and 8-10 parts of additive, wherein the graphene nanometer modified powder is prepared in the manner of ultrasonically mixing the graphene mixed powder in the first solvent and then drying; the graphene mixed powder contains the following components in parts by weight: 15-20 parts of graphene, 2-4 parts of graphene oxide and 5-8 parts of nanometer ceramic; the nanometer ceramic contains Al2O3 nanometer ceramic and aluminum nitride (AlN) nanometer ceramic; the weight ratio of Al2O3 nanometer ceramic to aluminum nitride (AlN) nanometer ceramic is 5:3; the content of graphene nanometer modified powder is within 4wt%-7wt%.

Description

technical field [0001] The invention relates to the field of heat dissipation materials, in particular to a high-efficiency graphene nano-modified heat dissipation material and a preparation method thereof, which can solve the heat conduction problem of electronic components in the fields of microelectronics, aerospace, military equipment, semiconductor lighting, electrical appliances, etc. . Background technique [0002] As a functional material with strong application prospects, high thermal conductivity materials can play an important role in many manufacturing and high-tech fields such as microelectronics, aerospace, military equipment, semiconductor lighting, electrical appliances, etc. due to their good thermal conductivity. Especially in recent years, with the development of integration technology, microelectronic packaging technology and semiconductor lighting, the total power density of electronic components has continued to increase, while the physical size of elec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L23/06C08L67/02C08K9/02C08K3/04C08K3/22C08K3/38C09K5/14
CPCC08K3/04C08K3/22C08K3/38C08K9/02C08K2003/2227C08K2003/282C08K2201/011C08K2201/014C08L2203/20C08L2207/062C09K5/14C08L23/06C08L67/02
Inventor 汤和平汤海滨汤丽婉汤丽勤汤远照张水机汤进生汤炀
Owner 厦门科一新材料有限公司
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