A kind of metal mask preparation method resistant to boe corrosion
A metal mask and mask technology, which is applied in metal material coating process, vacuum evaporation plating, coating and other directions, can solve the problems of loss of graphic line accuracy, sample contamination, low efficiency, etc., to improve the accuracy of sample structure, The effect of reducing coating stress and simplifying the process flow
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[0032] Such as figure 1 As shown, the present invention proposes a metal mask preparation method resistant to BOE corrosion, the steps are as follows:
[0033] Step a: cleaning the target object to be coated;
[0034] Specifically: soak the target object in a cleaning solution mixed with concentrated sulfuric acid and hydrogen peroxide. The temperature of the mixed cleaning solution is 80-130°C, and the soaking time is 15-30 minutes. The mixture of concentrated sulfuric acid and hydrogen peroxide will produce a lot of bubbles (O 2 ) and release heat, the air bubbles will take away the dust and particle attachments on the surface of the target, the concentrated sulfuric acid will corrode the organic pollutants, and heating will help to clean the target thoroughly.
[0035] Step b: performing coating treatment on the target object after cleaning;
[0036] The main innovation of the present invention is concentrated in that: a single-layer Cr / Au mask is used for coating treat...
Embodiment 1
[0044] Step a, cleaning: put the quartz crystal substrate in H 2 o 2 : Concentrated H 2 SO 4 =1:3 ratio to prepare cleaning solution, heat to 110°C, soak for 20-30min, take out and wash with warm water.
[0045] Step b, coating: ①Put the cleaned and dried quartz crystal substrate into the sputter coater, and evacuate to 3E-7Torr; ②Heat the quartz crystal substrate to about 320°C; ③Flow Ar and N 2 , change N 2 The proportion of the volume occupied by A, B, C, D, E a total of 5 groups of comparative tests, A, B, C, D, E N 2 The volume ratios are 20%, 40%, 50%, 60% and 80% respectively, and the sputtering chamber pressure is kept at 5mTorr, the sputtering power is 150W, and a 30nm thick Cr film is plated; The chamber pressure is 10mTorr, the sputtering power is set to 200W, and the Au film coating with a thickness of 200nm is completed; ⑤ Cool down to room temperature naturally, and take out the coated quartz crystal substrate.
[0046] Place the quartz crystal substrates c...
Embodiment 2
[0048] Step a, cleaning: put the quartz crystal substrate in H 2 o 2 : Concentrated H 2 SO 4 =1:5 ratio to prepare cleaning solution, heat to 130°C, soak for 15-25min, take out and wash with warm water.
[0049]Step b, coating: ①Put the cleaned and dried quartz crystal substrate into the sputter coater, and evacuate to the set value of 1E-7Torr; ②Heat the quartz crystal substrate to about 240°C; ③Flow in Ar and N 2 , N 2 The volume ratio is 55%, keep the sputtering chamber pressure at 10mTorr, sputtering power at 150W, and complete the 20nm thick Cr film plating; Complete the 300nm thick Au film plating; ⑤ naturally cool to room temperature, take out the coated quartz crystal substrate.
[0050] Place the obtained quartz crystal substrate plated with a single-layer Cr / Au mask in BOE (40% HF solution: 40% NH 4 F solution = 1:2) in the corrosion solution, soak for 20 hours. According to the analysis of the corrosion results, the single-layer Cr / Au mask on the surface of t...
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