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Photoetching instrument and microstructure pattern photoetching method used in preparation of metamaterial

A lithography instrument and microstructure technology, applied in the field of metamaterials, can solve the problems of complex manufacturing process and low manufacturing efficiency, and achieve the effects of simplifying the manufacturing process, realizing precise movement and high light intensity

Pending Publication Date: 2017-10-24
KUANG CHI INST OF ADVANCED TECH
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  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the problems of complex manufacturing process and low manufacturing efficiency of metamaterial devices in the related art, the present invention proposes a photolithography apparatus and microstructure pattern photolithography method applied in the preparation of metamaterials, which can simplify the manufacturing process of metamaterial devices , to improve the manufacturing efficiency of metamaterial devices

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  • Photoetching instrument and microstructure pattern photoetching method used in preparation of metamaterial
  • Photoetching instrument and microstructure pattern photoetching method used in preparation of metamaterial
  • Photoetching instrument and microstructure pattern photoetching method used in preparation of metamaterial

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Embodiment Construction

[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

[0043] According to an embodiment of the present invention, a photolithography apparatus applied in the preparation of metamaterials is provided.

[0044] Such as figure 1 As shown, the lithography apparatus used in the preparation of metamaterials according to the embodiment of the present invention includes:

[0045] The beam splitter 1 is used to divide the received laser beam into two or more coherent light beams (two coherent light beams are shown here) and output them;

[0046] The Po...

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Abstract

The invention discloses a photoetching instrument and microstructure pattern photoetching method used in preparation of a metamaterial. The photoetching instrument comprises a beam splitter and a pockels box, wherein the beam splitter is used for dividing a received laser beam into more than two beams of coherent light and outputting the coherent light, the pockels box is used for receiving and adjusting a phase of at least one first coherent light of the two beams of coherent light and outputting the at least one first coherent light after the phase is adjusted, and the at least one first coherent light output from the pockels box and second coherent light which is output from the beam splitter and is not received and adjusted by the pockels box are intervened with each other on a substrate so as to form a microstructure pattern on the substrate. With the adoption of a periodic pattern formed by laser interference, the manufacturing process can be simplified; and by employing the pockels box to adjust optical path different, the light intensity of the coherent light at an interference position is high to form an interference pattern, accurate moving of the interference pattern is achieved, the preparation efficiency is improved, and the manufacturing accuracy of the pattern is also improved.

Description

technical field [0001] The invention relates to the field of metamaterials, in particular to a photolithography apparatus and a microstructure pattern photolithography method applied in the preparation of metamaterials. Background technique [0002] In related technologies, when preparing metamaterial devices, there are mainly the following methods, one is to use photolithography technology, specifically: select different light sources such as ultraviolet light, X-rays, electron beams, ion beams, etc. The image of the template is exposed to the photosensitive adhesive, and then the metal is deposited, and finally the metal pattern is obtained by removing the glue; the other is to use the template deposition technology, and the metal can be deposited on the substrate through the through hole structure of the template, thus forming a metal pattern. However, both of the above two solutions require the use of masks or templates, and when changing the shape of the metamaterial ce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/20G03F7/70408
Inventor 不公告发明人
Owner KUANG CHI INST OF ADVANCED TECH
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