A method of fabricating a selectively doped structure
A selective, matrix technology, applied in the field of solar cells, can solve problems such as difficult mass production, large damage to silicon wafers, and surface concentration in lightly doped regions, so as to reduce surface recombination and emitter layer recombination, improve open circuit voltage and Short-circuit current, the effect of improving the quantum response
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Embodiment 1
[0034] see Figure 1 to Figure 5 As shown, a method for fabricating a selectively doped structure provided in this embodiment includes the following steps:
[0035] S101. Select a P-type crystalline silicon substrate 10 of 156mm*156mm, and perform texturing and cleaning treatment on the surface of the P-type crystalline silicon substrate 10; the resistivity of the P-type crystalline silicon substrate 10 is 0.5-15Ω·cm, preferably 1~ 5Ω·cm; the thickness of the P-type crystalline silicon substrate 10 is 50-300 μm, preferably 80-200 μm.
[0036] S102. Use an ion implanter to perform ion implantation on the front surface of the P-type crystalline silicon substrate 10 processed in step S101. The implanted element is phosphorus, and the implantation dose is 0.5×10 15 cm -2 ~3×10 15 cm -2 , preferably 1.5×10 15 cm -2 ~2.5×10 15 cm -2 . After the implantation is completed, a phosphorus-doped amorphous silicon layer 13 is formed on the front surface of the P-type crystalline s...
Embodiment 2
[0048] see Figure 1 to Figure 5 As shown, a method for fabricating a selectively doped structure provided in this embodiment includes the following steps:
[0049] S101. Select an N-type crystalline silicon substrate 10 of 156mm*156mm, and perform texturing and cleaning treatment on the surface of the N-type crystalline silicon substrate 10; the resistivity of the N-type crystalline silicon substrate 10 is 0.5-15Ω·cm, preferably 1- 5Ω·cm; the thickness of the N-type crystalline silicon substrate 10 is 50-300 μm, preferably 80-200 μm.
[0050] S102. Use an ion implanter to perform ion implantation on the back surface of the N-type crystalline silicon substrate 10 processed in step S101. The implanted element is phosphorus, and the implantation dose is 0.5×10 15 cm -2 ~3×10 15 cm -2 , preferably 1.5×10 15 cm -2 ~2.5×10 15 cm -2 . After the implantation is completed, a phosphorus-doped amorphous silicon layer 13 is formed on the back surface of the N-type crystalline si...
Embodiment 3
[0054] see Figure 1 to Figure 5 As shown, a method for fabricating a selectively doped structure provided in this embodiment includes the following steps:
[0055] S101. Select an N-type crystalline silicon substrate 10 of 156mm*156mm, and perform texturing and cleaning treatment on the surface of the N-type crystalline silicon substrate 10; the resistivity of the N-type crystalline silicon substrate 10 is 0.5-15Ω·cm, preferably 1- 5Ω·cm; the thickness of the N-type crystalline silicon substrate 10 is 50-300 μm, preferably 80-200 μm.
[0056] S102. Use an ion implanter to perform ion implantation on the front surface of the N-type crystalline silicon substrate 10 processed in step S101. The implanted element is boron, and the implantation dose is 0.5×10 15 cm -2 ~3×10 15 cm -2 , preferably 1.5×10 15 cm -2 ~2.5×10 15 cm -2 . After the implantation is completed, a boron-doped amorphous silicon layer 13 is formed on the back surface of the N-type crystalline silicon sub...
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