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Low-temperature vacuum evaporation source

A low-temperature vacuum, evaporation source technology, applied in vacuum evaporation coating, ion implantation coating, metal material coating process and other directions, can solve the problems of difficult evaporation, difficult to achieve special material coating technology, etc., to achieve low cost, structure and Simple operation and the effect of reducing heat loss

Pending Publication Date: 2017-09-29
DALIAN JIAOTONG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the evaporation source temperature of my country's evaporation source equipment is generally between 250-2000 °C, which can evaporate iron, chromium, nickel and other metals, and it is difficult to evaporate certain metal compounds and organic substances, such as AS, Sb, Ba, Bi, K , Li, Mg, etc. The evaporation or sublimation temperature of these substances is lower than 1000°C. The current evaporation equipment cannot achieve a perfect cooling effect, and it is difficult to achieve the coating technology for special substances.

Method used

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Embodiment Construction

[0042] Such as figure 1 , figure 2 , image 3 with Figure 4 A low-temperature vacuum evaporation source shown, including: a heating system, a cooling system, a temperature measurement system, a control system, and connecting components;

[0043] The heating system includes:

[0044] Electrode port 8, heating filament 16, shielding cover 13, crucible 14, fixing ring 15, negative plate 17 and electrode connector 11;

[0045] Among them, the heating filament 16 and a plurality of fixing rings 15 form a hollow cylindrical heating core, the shielding cover 13 covers the outside of the heating core, the crucible 14 is embedded in the top of the heating core, the bottom plate 17 is fixed at the bottom of the heating core, and the heating filament 16 protrudes The power supply joint of the electrode connector 11 is connected with the power supply line extending from the electrode port 8;

[0046] The cooling system includes:

[0047] Cooling cover 20, water inlet pipe 18, wate...

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Abstract

The invention discloses a low-temperature vacuum evaporation source. The low-temperature vacuum evaporation source comprises a heating system, a cooling system, a temperature measuring system, a control system and a connecting assembly. An electrode in the device is electrified to heat a lamp filament of the heating system, and when the temperature of the lamp filament reaches the sublimation temperature of substances in a crucible, a source substance starts to be evaporated, gas molecules obtained through evaporation are transmitted to a to-be-coated base body in a vacuum cavity, and evaporation of alkaline metal and an organic compound can be achieved. A real-time evaporation temperature of a thermocouple of the temperature measuring system is conducted and detected through an electric couple wire. Cooling water is led into a water inlet pipe of the cooling system, the crucible is cooled through water circulation in a cooling cover, and the low-temperature evaporation effect is achieved. A rotation baffle on a crucible opening can adjust and control whether the substances obtained through evaporation conduct coating on the base body or not through a manual rod.

Description

technical field [0001] The invention relates to the field of vacuum equipment, in particular to a low-temperature vacuum evaporation source equipment. Background technique [0002] Coating technology originated in the 1930s and was greatly developed until the late 1970s. In the 1960s, in order to meet the requirements of microwave and optical devices, people have been hoping to obtain high-quality low-dimensional materials. Molecular beam epitaxy (MBE) has emerged as a method that can provide higher quality thin film growth. MBE is a technique for epitaxially growing high-quality single-product films and nanostructures in an ultra-high vacuum environment (10-8pa). The process is to heat the raw material to be formed into a thin film in the evaporation container, so that its atoms or molecules escape from the surface to form a vapor flow, which is incident on the surface of a solid (called a substrate or substrate), and the deposited atoms (molecules) pass through Nucleati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/26
CPCC23C14/26
Inventor 郭方准张晓敏臧侃董华军李红娟杨云
Owner DALIAN JIAOTONG UNIVERSITY
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