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Diffusion furnace for silicon wafers for solar cells capable of relieving residual thermal stress

A technology for solar cells and residual thermal stress, which is applied in the directions of post-processing, diffusion/doping, and crystal growth, and can solve problems such as fracture, silicon chip damage, and thermal stress that are difficult to eliminate

Active Publication Date: 2018-03-13
徐州中辉光伏科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after the existing diffusion furnace completes the diffusion process, it often directly takes out the silicon wafer from the diffusion furnace; the working temperature in the diffusion furnace often reaches 800 to 950°C, and the silicon wafer is directly taken out from the above temperature environment to room temperature. During the process, the internal thermal stress of the silicon wafer is difficult to eliminate during the processing process. The residual thermal stress in the silicon wafer is easily damaged or even broken under the influence of sudden temperature changes, which in turn affects the production and production of the silicon wafer. Processing process

Method used

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  • Diffusion furnace for silicon wafers for solar cells capable of relieving residual thermal stress
  • Diffusion furnace for silicon wafers for solar cells capable of relieving residual thermal stress
  • Diffusion furnace for silicon wafers for solar cells capable of relieving residual thermal stress

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Effect test

Embodiment 1

[0024] Such as figure 1 A silicon wafer diffusion furnace for solar cells that can realize residual thermal stress relief treatment is shown, which includes a furnace body 1, which is provided with an air inlet pipe 2 and an exhaust gas pipe leading from the outside to the inside of the furnace body 1. The pipeline 3 is provided with an exhaust fan 4 above the exhaust pipeline 3; the inside of the furnace body 1 is provided with a quartz boat 5 for placing silicon wafers; A furnace door 6 is provided, and a heat dissipation pipe 7 extending toward the outside of the furnace body 1 is provided between the edge of the placement end surface 101 and the furnace door 6; in the furnace body 1, an exhaust pipe 3 is provided with A plurality of heat dissipation ports 8 lead to the heat dissipation pipe 7 , and the plurality of heat dissipation ports 8 are evenly distributed along the axial direction of the heat dissipation pipe 7 .

[0025] As an improvement of the present invention,...

Embodiment 2

[0029] As an improvement of the present invention, such as figure 1 As shown, in the heat dissipation pipe 7, a flow guide end body 11 is respectively arranged between any two adjacent heat dissipation ports 8, and the flow guide end body 11 extends in a ring along the inner wall of the heat dissipation pipe 7, and the flow guide end body 11 The side end surfaces in the axial direction of the heat dissipation pipe 7 all adopt a curved surface structure that bends toward the inside of the guide end body 11 . By adopting the above-mentioned technical scheme, it can guide the flow direction of the air flow output by the heat dissipation port through the arrangement of the flow guide end body, so that the air flow output by each heat dissipation port can flow between the two adjacent flow guide end bodies. Under the action of the curved surface structure, a circulation with a relatively fixed range of motion is formed in its corresponding area, so that the corresponding position o...

Embodiment 3

[0032] As an improvement of the present invention, such as figure 2 As shown, the heat dissipation pipeline 7 includes a first pipeline 701 connected to the end surface 101 of the furnace body 1, and a second pipeline 702 arranged at the end of the first pipeline 701; the length of the first pipeline 701 is 15 cm, the end of the first pipeline 701 is provided with an external thread, the end of the second pipeline 702 is provided with an internal thread, and the first pipeline 701 and the second pipeline 702 are connected by threads; the first pipeline 701 A first fixed end body 12 opposite to the end of the second pipe 702 is arranged on the outer wall, and a first tooth body 14 is arranged on the opposite end surface of the first fixed end body 12 and the second pipe 702. The first tooth body 14 and the second pipe 702 are engaged with each other, the inner wall of the second pipe 702 is provided with a second fixed end body 13 opposite to the end of the first pipe 701, the...

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Abstract

The invention discloses a cell silicon wafer diffusion furnace capable of achieving residual thermal stress relieving treatment. The solar cell silicon wafer diffusion furnace comprises a furnace body. An air feeding pipeline and an air discharging pipeline both communicating the outside to the inside are arranged in the furnace body, and an exhaust fan is arranged on the air discharging pipeline.A quartz boat for setting silicon wafers and a setting end face are both arranged in the furnace body. A furnace door is arranged on the setting end face; a radiating pipeline extending to the outside of the furnace body is arranged between the edge of the setting end face and the furnace door. In the furnace body, a plurality of radiating ports communicated with the radiating pipeline are arranged on the air discharging pipeline, and are distributed uniformly axially along the radiating pipeline. According to the solar cell silicon wafer diffusion furnace capable of achieving residual thermal stress relieving treatment, residual thermal stress of the insides of silicon wafers can be relieved effectively in the process of annealing of silicon wafers to guarantee completeness of the silicon wafers.

Description

technical field [0001] The invention relates to the field of preparation of solar cells, in particular to a silicon wafer diffusion furnace for solar cells that can realize residual thermal stress relief treatment. Background technique [0002] Solar energy is a clean, non-polluting and renewable energy that can be recycled. Converting solar energy into electrical energy is an important technology for effectively utilizing solar energy. Since Bequeral first discovered the photovoltaic effect in 1839 to 1954 when Bell Labs developed a monocrystalline silicon solar cell with an efficiency of 4.5%, the market is still growing at a rate of about 36% per year. At present, the solar cell has completed the first The first-generation crystalline silicon battery research is at the peak of the second-generation thin-film battery research, and efforts are being made to the third-generation high-efficiency battery research. As a crystalline silicon solar cell that occupies most of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B31/16C30B31/10C30B31/12
CPCC30B31/10C30B31/12C30B31/16
Inventor 吴卫伟皇韶峰
Owner 徐州中辉光伏科技有限公司
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