Flexible array substrate as well as manufacturing method and flexible display thereof

Abstract

The invention discloses a flexible array substrate as well as a manufacturing method and a flexible display thereof. The flexible array substrate comprises a flexible substrate, a display region arranged on one side of the flexible substrate, a non-display region arranged at the periphery of the display region, a protective layer used for covering a source and drain electrode layer of the non-display region and a protective layer block wall arranged on one side, close to the display region, of the non-display region and used for limiting a width of the protective layer. According to the flexible array substrate provided by the invention, the protective layer block wall is arranged on one side, close to the display region, of the non-display region and can limit a glue material from flowing toward a light emitting region when the protective layer of a bending region is manufactured, so that the width of the protective layer can also be limited while the uniformity of the coating thickness of the protective layer is guaranteed, a climbing region can be effectively shortened, and realization of the narrow frame effect is facilitated.

Description

technical field [0001] The invention relates to the technical field of flexible display screens, in particular, the invention relates to a flexible array substrate, a manufacturing method thereof, and a flexible display. Background technique [0002] At present, existing display products (such as Samsung Galaxy Note7) use the bendability of flexible substrates to bend the position (Fanout, fan-out area) where the pixel leads are connected to external circuits to achieve the effect of narrow borders, which we call Pad bending (Pad bending) design, the specific structure before bending can refer to figure 1 . Compared with rigid OLED, the Fanout area designed by pad bending does not use gate (Gate) leads, but uses source-drain electrode (SD) layer to connect with external circuits. On the SD surface, there are only organic layers such as organic film (PLN) and pixel definition (PDL), which are easily corroded by water vapor after bending. Therefore, protective glue should b...

AI Technical Summary

Problems solved by technology

In the actual production process, due to the fluidity of the adhesive material, the thickness of B and C will generally be much lower than the middle position A, so it is easy to cause line breakage at positions D and E during bending

Therefore, in order to ensure a uniform glue thickness at the bending position, the glue material generally needs to be coated with a wider (about 700um) climbing area (Dummy) area, that is, the position shown in L1, so that the border is correspondingly wider, so as not to Conducive to achieve the effect of narrow border

[0004] Therefore, the pad bending design structure of flexible OLEDs at this stage still needs to be improved.

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