Turret type test device fast disassembling IC test base

Abstract

The invention relates to a turret type test device fast disassembling IC test base. The turret type test device fast disassembling IC test base comprises a pedestal, an IC interface board to be tested, a test base, an adapter base and multiple radio frequency signal lines. The fast disassembling IC test base can be connected with more radio frequency signal lines, can avoid mutual interference and winding of the radio frequency signal lines and can be fast and simply disassembled and assembled in the turret type test device without generating the problems of false connection and damage of the radio frequency signal lines.

Description

technical field [0001] The present invention relates to a quick-release IC test socket of a turret-type test device, in particular to a quick-release IC test socket of a turret-type test device for high-frequency testing. Background technique [0002] With the advancement and generalization of wireless communication technology, and the demand for IC size reduction and multi-function, the IC structure gradually adopts the design of small chips with multiple radio frequency functions, which means that a single IC chip no longer only has a single radio frequency (RF) Function, but with a variety of radio frequency functions, and the size of the IC is more reduced. After the production of these ICs with multiple radio frequency functions is completed, it is often necessary to perform various radio frequency tests on the IC to confirm the various radio frequency functions of the IC. Because such ICs are small in size, in order to increase the efficiency of testing, turret testin...

AI Technical Summary

Problems solved by technology

Therefore, the process of such disassembly and reassembly is not only slow and time-consuming, but also is easy to be easily confused when reassembling because the operator does not know the corresponding connection position of each radio frequency signal line on the IC interface board 14 to be tested. If the installation is wrong, the test will be abnormal, especially when the number of connected RF signal lines is more, it is easier to cause such a phenomenon

In addition, when the RF signal lines 16, 18, and 20 are connected back and locked to the IC interface board 14 to be tested, in addition to being easily misconnected due to confusion, it is often because the operator uses too much force or rotates too many turns, resulting in radio frequency failure. The signal lines 16, 18, and 20 are damaged, resulting in abnormal or failure of the RF test, which affects the pass rate and efficiency of the test

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