Double-sided surface mount electronic components and packaging method thereof

A technology of electronic components and packaging methods, which is applied in the direction of electrical components, electric solid-state devices, semiconductor devices, etc., and can solve problems such as small size, short circuit of positive and negative poles, etc.

Inactive Publication Date: 2017-07-28
王伟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the small size of such devices, after soldering to the circuit, the solder can easily flow to the side of the electronic component, causing a short circuit between the positive and negative terminals
This is more likely to happen with electronic components of small dimensions, only a few millimeters wide

Method used

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  • Double-sided surface mount electronic components and packaging method thereof
  • Double-sided surface mount electronic components and packaging method thereof
  • Double-sided surface mount electronic components and packaging method thereof

Examples

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Embodiment Construction

[0020] The specific implementation of the double-sided SMD electronic component and the packaging method of the double-sided SMD electronic component provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0021] In the following specific implementation manners, the first electrode is uniformly configured as a positive electrode, and the second electrode is configured as a negative electrode. In other specific implementation manners, the first electrode may also be configured as a negative electrode, and the second electrode may be configured as a positive electrode.

[0022] Reference attached Figure 1A Shown is a schematic structural view of the electronic component 10 in this specific embodiment, including a core 13 and a protective ring 14a. The core 13 is any component with positive and negative electrodes on two opposite surfaces, and can be selected from any one of diodes, capacitors, resistors and inductors....

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PUM

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Abstract

A double-sided surface mount electronic component comprises a core that is provided with a first electrode and a second electrode, respectively, on two opposite surfaces; and further includes a first insulating protective ring being arranged on the surface of the first electrode of the core and surrounding the first electrode to form a depressed portion. At least one end face of both end faces of the first insulating protective ring is raised to the electrode surface higher than the core to form the depressed portion. The depressed portion is provided with a conductive filler to ensure that the electrode of the core can be electrically connected to the outside.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, in particular to a double-surface chip electronic component and a packaging method thereof (DMT: Dual-surface Mounting Technology). Background technique [0002] Electronic components with two electrodes, such as diodes, capacitors, resistors, and inductors, are widely used in various electronic circuits. It is a common electrode arrangement method to arrange positive and negative electrodes on two opposite surfaces. However, due to the small size of such devices, after soldering to the circuit, the solder can easily flow to the side of the electronic component, causing a short circuit between the positive and negative terminals. This is more likely to happen with electronic components of small dimensions, only a few millimeters wide. Therefore, how to avoid side flow of solder for small-sized electronic components is a problem to be solved urgently in the prior art. Contents o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L21/56
CPCH01L23/3171H01L21/56H01L23/3185
Inventor 王伟
Owner 王伟
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