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Solar silicon wafer cutting fluid based on shear thickening mechanism, and preparation method thereof

A technology of solar silicon wafer and thickening mechanism, applied in the direction of lubricating composition, etc., can solve the problems of high diamond wire cutting cost, poor cutting quality and high cutting cost, so as to reduce cutting cost, low cutting cost and good cutting surface quality Effect

Active Publication Date: 2017-07-18
ZHENJIANG RENDE NEW ENERGY TECH
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Problems solved by technology

[0007] Aiming at the current problems of slow multi-wire cutting speed, poor cutting quality, high cutting cost, structural wire and diamond wire cutting cost, and difficult quality control and other problems, the present invention proposes a cutting ability, high efficiency, and low cost. , a simple preparation method based on non-Newtonian fluid shear thickening mechanism solar polysilicon wafer cutting fluid and preparation method thereof

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  • Solar silicon wafer cutting fluid based on shear thickening mechanism, and preparation method thereof

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preparation example Construction

[0026] The invention provides a cutting fluid for solar silicon wafers based on a shear thickening mechanism. The cutting fluid is composed of micro / nano silicon dioxide particles, a dispersion medium and SiC powder. / Nano silica particles, forming a cutting fluid with shear thickening effect. Its preparation method comprises the following steps:

[0027] 1. Pretreatment of micro / nano silica: Take a certain amount of micro / nano particles and dissolve them in the pretreatment dispersion medium. The mass ratio of micro / nano silica to the pretreatment dispersion medium is 1:50~60. Stir for 30-60min at 800-1000r / min;

[0028] 2. Preparation of micro / nano silica dispersion system: Weigh 0.3 to 0.6 parts by weight of the micro / nano silica solution pretreated in step 1, add it to 0.7 to 0.4 parts by weight of the dispersion medium, and mix it at 800 Stir for 30-60 minutes under the condition of ~1000r / min, and then use an ultrasonic cleaner to ultrasonically disperse for 30-60 minu...

Embodiment 1

[0037] Take 250ml of hydroxyl silicone oil and add it to 250ml of ethylene glycol, and stir evenly in a 3L container; take 10g of nano-silica particles, add them to the above dispersion medium, and stir at 950r / min for 60min; after the dispersion is uniform, add Stir 500ml PEG200 for 40min at 800r / min; then use an ultrasonic cleaner to ultrasonically disperse for 30min at a power of 200W to obtain a silica dispersion system; After the SiC powder was added, the mechanical stirring was continued for 2 hours to obtain a new type of shear thickening solar silicon wafer cutting fluid.

[0038] From attached figure 1 It can be seen that the cutting fluid has good shear thickening performance.

Embodiment 2

[0040] According to the preparation method and conditions of Example 1, diethylene glycol and PEG300 can also be used to obtain a cutting fluid in which silicon carbide is dispersed in a silicon dioxide dispersion system;

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Abstract

The invention provides a solar silicon wafer cutting fluid based on a shear thickening mechanism. The cutting fluid is prepared from micro / nano-silicon dioxide particles, dispersion media and SiC powder, wherein a certain part of micro / nano-silicon dioxide particles is dissolved in the dispersion media to form the cutting fluid with a shear thickening effect. The preparation method comprises the following main preparation steps: dissolving micro / nano particles into pretreatment dispersion media to obtain premixed liquid; further dispersing the premixed liquid in the dispersion media to obtain a micro / nano-silicon dioxide dispersion system; adding the SiC powder into the dispersion system to obtain the novel solar silicon wafer cutting fluid. Compared with traditional solar silicon wafer cutting fluid, the solar silicon wafer cutting fluid has the advantages of better dispersibility, stability and shear thickening performance, lower cutting cost and better cutting surface quality. The solar silicon wafer cutting fluid based on the shear thickening mechanism has the advantages of simple preparation technology, convenience in operation and easiness in realizing industrial production.

Description

technical field [0001] The invention relates to the technical field of micro-nano powder application, in particular to a solar silicon chip cutting fluid based on a shear thickening mechanism and a preparation method thereof. Background technique [0002] In recent years, with the strengthening of people's awareness of environmental protection, solar energy has been widely used as a green resource. Among them, silicon-based materials are the main materials for solar photovoltaics, accounting for more than 85% of the world's photovoltaic cells. As the front-end product of the photovoltaic industry, silicon wafers occupy an important position in the entire industrial chain. At present, the processing of silicon wafers mainly adopts the method of multi-wire cutting, that is, thousands of straight steel wires bring abrasives and cutting fluid to the cutting area. Cut silicon ingots to achieve rapid processing. [0003] In order to increase the cutting rate, it is hoped that t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M169/02
CPCC10M169/02
Inventor 刘瑞鸿孙培亚
Owner ZHENJIANG RENDE NEW ENERGY TECH
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