Heat Dissipation Structure and Packaging Technology of igbt Module in Power Converter

Abstract

The invention relates to a heat dissipation structure and packaging process of an IGBT module in a power converter. The structure includes a substrate, a chip, a heat sink, a graphene heat dissipation layer, a graphene-based interconnect material, a busbar and silica gel; chemical vapor deposition is used The single-layer graphene film prepared by the method is used as the heat dissipation layer on the surface of the chip. By exerting its excellent in-plane thermal conductivity, the local hot spot heat of the IGBT module in the power converter is quickly and laterally transferred to the heat sink; the oxidation-reduction method or solvent The few-layer graphene powder prepared by the exfoliation method is filled into the multi-modal silver particle conductive adhesive to enhance its electrical and thermal conductivity, and use it as the interconnection material between the chip and the substrate, the heat sink and the substrate, and improve the heat transfer from the chip to the substrate. The longitudinal conduction capacity of the substrate; the interconnection method of chip mounting is used to shorten the heat conduction path, enhance the heat dissipation performance of the overall structure, and realize the effective heat dissipation of local high heat flux hot spots, thereby reducing the maximum temperature of the IGBT module in the power converter and improving the device. service life.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a heat dissipation structure and packaging process of an IGBT module in a power converter. Background technique [0002] With the development of new power generation technologies such as wind power and solar photovoltaic power generation, distributed power generation systems have gradually become an effective way to meet the demand for load growth, reduce environmental pollution, and improve comprehensive energy utilization efficiency and power supply reliability. The demand for power converter capacity for energy conversion and storage between the generator and the grid is increasing, which requires the power device IGBT module to have a higher power level, and the failure rate of the large-capacity IGBT module cannot be ignored. [0003] The faults of medium and high voltage power converters due to the failure of IGBT modules account for more than 90%. When t...

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Problems solved by technology

[0003] The faults of medium and high voltage power converters due to the failure of IGBT modules account for more than 90%. When the IGBT modules are turned on or off repeatedly, failure or fatigue effects will occur under repeated thermal shocks, and their working life and reliability will be reduced. Affect the normal operation of the entire device or system

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