Heat-conductive silica gel compound, heat-conductive silica gel material, heat-conductive silica gel slice and preparation method thereof

A technology of heat-conducting silica gel sheet and heat-conducting silica gel, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of reducing heat-conducting silica gel, increasing interaction force, reducing thermal expansion coefficient of heat-conducting silica gel material, etc.

Inactive Publication Date: 2017-06-27
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to the large specific surface area of ​​multilayer graphene, the inventor found through a large number of experiments that when it is used as a thermally conductive material in a certain proportion with thermally conductive fillers, the specific surface area of ​​multilayer graphene in contact with the substrate is large, resulting in increased interaction force. Large, the restraining force on the silicone oil resin molecules is strengthened, which inhibits the th...

Method used

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  • Heat-conductive silica gel compound, heat-conductive silica gel material, heat-conductive silica gel slice and preparation method thereof
  • Heat-conductive silica gel compound, heat-conductive silica gel material, heat-conductive silica gel slice and preparation method thereof
  • Heat-conductive silica gel compound, heat-conductive silica gel material, heat-conductive silica gel slice and preparation method thereof

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preparation example Construction

[0024] The preparation method of the thermally conductive material provided by the invention comprises the following steps:

[0025] (1) Add the coupling agent to water or anhydrous ethanol solvent to prepare a coupling agent solution, add thermally conductive filler and multi-layer graphene to the coupling agent solution, stir, suction filter, and dry to obtain the thermally conductive agent material;

[0026] (2) Mix the above-mentioned pretreated thermal conductive agent with silicone resin and other additives, stir at high speed, vacuumize after mixing the materials, and solidify and form.

[0027] In step (1), the mass fraction of the coupling agent solvent is 1.0-2.4wt%. Add thermally conductive fillers and multi-layer graphene at a constant temperature of 60-70°C and continue to stir. After 20-60 minutes of heat preservation, suction filtration after the reaction is sufficient Drying, the drying temperature is 80-110°C.

[0028] The present invention also provides the ...

Embodiment 1~7

[0032] This embodiment is used to illustrate the thermally conductive silica gel sheet provided by the present invention and its preparation method.

[0033] (1) Preparation of heat conducting agent

[0034] Prepare 500 g of a silane coupling agent absolute ethanol solution with a concentration of 1.5 wt%, and place it in an oil bath at 65°C. First add a certain amount of multilayer graphene powder, stir at 1000rmp for 10 minutes, then add a certain amount of boron nitride powder and continue stirring for 20 minutes. After the reaction was completed, it was suction filtered, and then dried in a blast drying oven at 110° C. to obtain a heat conducting agent. Refer to the data in Table 1 for the specific group distribution ratio.

[0035] (2) Preparation of thermally conductive silica gel sheet:

[0036] Weigh a certain amount of heat conducting agent prepared in step (1), together with silicone, and at least one of antioxidant, heat stabilizer, light stabilizer, lubricant, etc...

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Abstract

The invention provides a heat-conductive silica gel compound. The heat-conductive silica gel compound contains a heat-conductive agent, an organic silica gel and other auxiliaries, wherein the heat-conductive agent is composed of heat-conductive filler, multilayer graphene and a coupling agent; the content of heat-conductive filler in the heat-conductive agent is 75-86wt%; the content of multilayer graphene in the heat-conductive agent is 2-13wt%; the content of coupling agent in the heat-conductive agent is 1-2.4wt%. The heat-conductive silica gel compound is high in mobility and high in filling capacity. The prepared heat-conductive silica gel slice has higher thermal conductivity and low coefficient of thermal expansion. The invention also provides a preparation method for the heat-conductive silica gel slice and the heat-conductive silica gel slice prepared according to the method.

Description

technical field [0001] The invention relates to a heat-conducting silica gel composition, a heat-conducting silica gel material prepared from the heat-conducting silica gel composition, a method for preparing a heat-conducting silica gel sheet, and a heat-conducting silica gel sheet prepared by the method. Background technique [0002] With the development of microelectronics technology, electronic components are becoming thinner, lighter, smaller, and more multifunctional, and the assembly density of components is getting higher and higher. The heat dissipation of heating elements has become a prominent problem. If the accumulated heat cannot be dissipated in time, it will lead to an increase in the operating temperature of the components, which will directly affect the life and reliability of various high-precision equipment. Therefore, in order to better reduce the thermal resistance of the device and improve the overall heat transfer capability, it is necessary to use a ...

Claims

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Application Information

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IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 周维毛碧峰
Owner BYD CO LTD
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