Silicon wafer wire cutting machine

Abstract

The invention discloses a silicon wafer wire cutting machine which comprises a cutting head, a feeding table, a feeding table fixing frame, a wire winding and unwinding tool, a wire drum chamber and a main motor. The feeding table is fixed to the feeding table fixing frame. The cutting head is located below the feeding table. The wire winding and unwinding tool is arranged on one side of the cutting head, and a wire drum chamber is arranged on the other side of the feeding table fixing frame. Mortar nozzles are arranged on the two sides of a cutting guiding wheel, after boxes are fully filled with mortar, the mortar flows out at a constant speed, impact force on the silicon wafer is small, and the mortar on the two sides can be evenly distributed on a wire net. According to the cutting head of the silicon wafer wire cutting machine, the central distance between mounting holes is smaller, the wire net is smaller, stability is higher, wires are not prone to breaking, cutting quality is higher, and production efficiency and the silicon wafer percent of pass are increased.

Description

technical field [0001] The invention belongs to the technical field of silicon wafer wire cutting, in particular to a silicon wafer wire cutting machine. Background technique [0002] For the cutting head of the traditional silicon wafer wire cutting equipment, the center distance of the bearing box is relatively wide, the center distance is wide, the rotation speed of the guide wheel is slow, the cutting efficiency is low, the wire is easily broken during the cutting process, the silicon wafer is easy to break, and more serious Cause the entire silicon rod to break. The original mortar nozzle is directly sprayed on the silicon wafer or the wire net, and the impact force of the mortar on the silicon wafer is relatively large, which may easily cause the silicon wafer to break, and the mortar cannot be evenly distributed on the wire net; in addition, the traditional mortar nozzle is used in a large number, and the installation is cumbersome . [0003] There are two guide w...

AI Technical Summary

Problems solved by technology

[0002] For the cutting head of the traditional silicon wafer wire cutting equipment, the center distance of the bearing box is relatively wide, the center distance is wide, the rotation speed of the guide wheel is slow, the cutting efficiency is low, the wire is easily broken during the cutting process, the silicon wafer is easy to break, and more serious cause the entire silicon rod to break

The original mortar nozzle is directly sprayed on the silicon wafer or the wire net, and the impact force of the mortar on the silicon wafer is relatively large, which may easily cause the silicon wafer to break, and the mortar cannot be evenly distributed on the wire net; in addition, the traditional mortar nozzle is used in a large number, and the installation is cumbersome

[0003] There are two guide wheels on the take-up and release tooling of the traditional silicon wafer wire cutting equipment. The cutting line is in an S-shaped direction, and it is easy to get off the line, resulting in broken lines.

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