LED device, LED lamp and method for processing conductive bonding wire of LED device

Abstract

The invention discloses an LED device. The LED device comprises an LED chip, a support for bearing the LED chip, a conductive bonding wire for connecting an LED chip electrode and the support as well as a packaging glue body for covering the LED chip and the conductive bonding wire, wherein the support comprises an insulation area as well as a first electric connection area and a second electric connection area which are located on two sides of the insulation area respectively, the LED chip is mounted in the first electric connection area, one end of the conductive bonding wire is located at the LED chip electrode, the other end of the conductive bonding wire is located in the second electric connection area, and the conductive bonding wire comprises a vertical section, a first bending section, a second bending section and a connecting section. The invention further discloses an LED lamp and a method for processing the conductive bonding wire of the LED device. The stress bearing capacity of the conductive bonding wire is improved by a three-dimensional structure formed by the vertical section, the first bending section, the second bending section and the connecting section of the conductive bonding wire, so that the overall service life of the device is prolonged.

Description

technical field [0001] The invention relates to the technical field of LED devices, in particular to an LED device, an LED lamp using the LED device and a method for processing conductive welding wires in the LED device. Background technique [0002] See attached figure 1 As shown, the LED device in the prior art includes a support 1a, and the support 1a is provided with a first electrical connection area 11a, an insulating area 12a and a second electrical connection area 13a in sequence, wherein the LED chip is mounted on the first electrical connection area 11a, Among them, the LED chip and the bracket need to be connected by conductive bonding wires, so as to realize the conduction of the LED chip. After the two ends of the conductive bonding wires are respectively welded, the bracket 1a needs to be covered with encapsulating gel, and the encapsulating gel covers the LED chip and the conductive bonding wires on it. Inside. [0003] However, when using LED devices, the e...

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Problems solved by technology

[0005] However, the gold wire (conductive bonding wire) in the above-mentioned published patent is a two-dimensional structure, and its straight line section only has a certain stress buffering effect on the length direction of the gold wire (conductive bonding wire), and because the gold wire (conductive bonding wire) is The whole body is wrapped by encapsulation colloid, and the thermal expansion and contraction of the encapsulation colloid will produce stress impact on the entire conductive bonding wire, and the stress impact has no fixed direction, that is, the gold wire (conductive bonding wire) will be affected by pressure from up, down, left, right or other different directions. Stress impacts in regular directions, if these stresses are not buffered, or are only partially buffered, other conductive bonding wires that cannot be buffered by stress will be damaged in advance, thus greatly reducing the overall service life of LED devices

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