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Radically polymerizable adhesive agent composition, and method for manufacturing electrical connector

A manufacturing method, free radical technology, applied in adhesive heating bonding method, connection, adhesive, etc., can solve the problem of wafer shear strength drop and other problems, and achieve the effect of promoting thermal free radical polymerization reaction

Active Publication Date: 2017-05-24
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, if there is a light-shielding portion such as metal wiring in the electronic device, light cannot sufficiently irradiate the uncured adhesive layer due to the light-shielding portion, and the die shear strength of the joint portion may decrease. question

Method used

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  • Radically polymerizable adhesive agent composition, and method for manufacturing electrical connector

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Experimental program
Comparison scheme
Effect test

Embodiment 1～5、 comparative example 1～4

[0071] A mixture (adhesive composition) obtained by mixing the components of the composition shown in Table 1 by a conventional method was applied to a release polyester film and dried at 70° C. to obtain a 20 μm thick adhesive sheet.

[0072]

[0073] The obtained adhesive sheet was sandwiched between an IC (outer dimensions: 1.8 mm x 20 mm, bump height 15 μm) as an evaluation substrate and aluminum wire electrodes (light-shielding part ) between ITO-coated glass (glass thickness 0.5mm, ITO thickness 200nm) as the base glass substrate, heat and press the IC under the conditions of crimping temperature 100°C, crimping pressure 80MPa, crimping time 5 seconds, 2 seconds after the start of heating, UV irradiation was carried out for 3 seconds from the back side of the glass substrate (side on which the aluminum wire electrodes were formed) under the UV irradiation conditions (UV light source: UV irradiator ZUV-C30H (Omron Co., Ltd.)) in Table 1, Thus, an electrical connector fo...

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PUM

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Abstract

A radically polymerizable adhesive agent composition according to the present invention comprises a radically polymerizable compound, a thermal radical polymerization initiator, a cationically polymerizable compound and a photoacid generator. The photoacid generator has a property of accelerating the thermal radical polymerization reaction of the radically polymerizable adhesive agent composition, and the content of the cationically polymerizable compound in the radically polymerizable adhesive agent composition is 0.25 to 3.75 parts by mass relative to 1 part by mass of the photoacid generator. The content of the photoacid generator in the radically polymerizable adhesive agent composition is 1.0 to 30 parts by mass relative to 100 parts by mass of the thermal radical polymerization initiator.

Description

technical field [0001] The present invention relates to a radical polymerizable adhesive composition containing a radical polymerizable compound, a thermal radical polymerization initiator, a photoacid generator, and a cationic polymerizable compound. Background technique [0002] Manufacture of electrical connectors in which electronic devices such as liquid crystal panels and organic EL panels are laminated with other electronic devices such as IC chips and flexible substrates via an uncured adhesive layer made of a curable adhesive composition is widely carried out. Thereafter, the uncured adhesive layer is cured to become a cured adhesive layer to manufacture an electrical connector. In this case, if excessive heating is performed to cure the uncured adhesive layer, the electrical connector may be warped and the electronic device may be damaged. Therefore, as a curable adhesive composition, a photocationically polymerizable adhesive composition in which a photocationica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/00C09J7/00C09J11/06C09J163/00H01R43/00
CPCC09J4/00C09J11/06C09J163/00H01R43/00C09J7/00C09J5/06C09J2203/326
Inventor 林慎一田中佑治
Owner DEXERIALS CORP
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