Spelter solder
A technology of brass solder and raw materials, applied in welding/cutting medium/material, welding equipment, welding medium, etc., can solve problems such as micro-cracks, and achieve the effect of improving fluidity, refining grains, and reducing melting point
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Embodiment 1
[0027] A kind of brass solder, calculated by weight percentage, comprising the following raw materials:
[0028] Copper 55%, tin 0.9%, bismuth 0.8%, silicon 0.09%, manganese 0.07%, and germanium 0.04%, the balance is zinc.
[0029] Preparation:
[0030] 1) Prepare a total of 5000 grams of each material according to the above formula;
[0031] 2) Put Si into an induction furnace and heat it to above 1500°C and melt it;
[0032] 3) Then cool down to 1100°C and add Cu;
[0033] 4) Add Zn and stir fully, while rapidly reducing the temperature of the molten metal to 960°C;
[0034] 5) After the molten metal is uniform, add Bi and Ge and stir fully;
[0035] 6) Add Sn and Mn and stir evenly, then cast;
[0036] 7) The brazing alloy is obtained by extruding and wire drawing according to the conventional brazing filler metal processing method.
Embodiment 2
[0038] A kind of brass solder, calculated by weight percentage, comprising the following raw materials:
[0039] Copper 58%, tin 0.5%, bismuth 0.3%, silicon 0.05%, manganese 0.03%, and germanium 0.02%, the balance is zinc.
[0040] The preparation method of the brass solder in this embodiment is consistent with the method described in embodiment 1, the only difference is that the weight percentage of each component of the brass solder is weighed according to the ratio in this embodiment.
Embodiment 3
[0042] A kind of brass solder, calculated by weight percentage, comprising the following raw materials:
[0043] Copper 52%, tin 1%, bismuth 1.2%, silicon 0.15%, manganese 0.08%, and germanium 0.06%, the balance is zinc.
[0044] The preparation method of the brass solder in this embodiment is consistent with the method described in embodiment 1, the only difference is that the weight percentage of each component of the brass solder is weighed according to the ratio in this embodiment.
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