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Copper plating solution for plate roller and preparation method of copper plating solution

The technology of a copper plating solution and plate roller is applied in the field of plate roller copper plating solution and its preparation, which can solve the problems of insufficient smoothness of the plating layer, low brightness of the plating layer, poor surface uniformity, etc., and achieve simple preparation method, good surface uniformity, good weather resistance

Inactive Publication Date: 2017-05-10
LONGYOU YUNSHEN PLATE MAKING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The quality of the pre-treatment of the plate roller in copper plating and chrome plating is the key link to ensure the quality of the coating. It is impossible to obtain a smooth and bright coating with good adhesion on the oxidized, rusted or oily surface. Therefore, it is necessary to do a good job in the pre-plating treatment. Unclear oil stains on the plate surface are one of the main factors causing copper or chromium loss. In addition, high-quality copper plating solution is also one of the main factors that determine the copper plating effect of plate rollers. Most of the existing copper plating solutions are ordinary The copper liquid makes the version roller prone to burrs and particle protrusions after copper plating, making the coating not smooth enough, and the bonding force between the coating and the version roller is not good, and it is easy to cause delamination
[0004] Therefore, in summary, the existing copper plating solution used for version rollers has complex preparation methods, and the coating made by copper plating solution on version rollers has low brightness, low hardness and weak wear resistance, which makes the outer surface of version rollers After the layer is combined with the coating, it is easy to produce burrs, and there are problems such as poor surface uniformity and poor weather resistance

Method used

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  • Copper plating solution for plate roller and preparation method of copper plating solution
  • Copper plating solution for plate roller and preparation method of copper plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A plate roller copper plating solution, made of the following raw materials in parts by weight: including 56 parts of copper sulfate pentahydrate, 30 parts of hydroxybutylene diphosphonic acid, 33 parts of methylaminodimethylidene phosphonic acid, and 26 parts of tripotassium citrate , 24 parts of trisodium citrate, 12 parts of polyethyleneimine, 40 parts of boric acid, 11 parts of sodium hydroxide, 13 parts of glycerin, 10 parts of pyrophosphate, 11 parts of thiosulfate, and 11 parts of sulfite , 10 parts of sodium lauryl sulfate, 9 parts of sodium 2-ethylhexanol sulfate, 9 parts of dioctyl sodium sulfosuccinate, 12 parts of sodium phosphate diester and 100 parts of water.

[0020] A preparation method for plate roller copper plating solution, comprising the following steps:

[0021] 1) Take 100 parts of water and pour it into the pot, and heat it to 50°C to make warm water, set aside;

[0022] 2) Get 40% of the warm water total amount after heating in step 1) and put...

Embodiment 2

[0028] A plate roller copper plating solution, made of the following raw materials in parts by weight: including 40 parts of copper sulfate pentahydrate, 50 parts of hydroxybutylene diphosphonic acid, 41 parts of methylaminodimethylidene phosphonic acid, and 38 parts of tripotassium citrate , 30 parts of trisodium citrate, 18 parts of polyethyleneimine, 60 parts of boric acid, 19 parts of sodium hydroxide, 17 parts of glycerol, 14 parts of pyrophosphate, 15 parts of thiosulfate, and 17 parts of sulfite , 16 parts of sodium lauryl sulfate, 13 parts of sodium 2-ethylhexanol sulfate, 15 parts of dioctyl sodium sulfosuccinate, 18 parts of sodium phosphate diester and 160 parts of water.

[0029] A preparation method for plate roller copper plating solution, comprising the following steps:

[0030] 1) Take 160 parts of water and pour it into the pot, and heat it to 60°C to make warm water, set aside;

[0031] 2) Get 40% of the warm water total amount after heating in step 1) and p...

Embodiment 3

[0037] A plate copper plating solution, made of the following raw materials in parts by weight: including 48 parts of copper sulfate pentahydrate, 40 parts of hydroxybutylene diphosphonic acid, 37 parts of methylaminodimethylidene phosphonic acid, and 32 parts of tripotassium citrate , 27 parts of trisodium citrate, 15 parts of polyethyleneimine, 50 parts of boric acid, 15 parts of sodium hydroxide, 15 parts of glycerol, 12 parts of pyrophosphate, 13 parts of thiosulfate, and 14 parts of sulfite , 13 parts of sodium lauryl sulfate, 11 parts of sodium 2-ethylhexanol sulfate, 12 parts of dioctyl sodium sulfosuccinate, 15 parts of sodium phosphate diester and 130 parts of water.

[0038] A preparation method for plate roller copper plating solution, comprising the following steps:

[0039] 1) Take 130 parts of water and pour it into the pot, and heat it to 55°C to make warm water, set aside;

[0040] 2) Get 40% of the warm water total amount after heating in step 1) and put it i...

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PUM

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Abstract

The invention discloses a copper plating solution for a plate roller. The copper plating solution is prepared from the following raw materials in parts by weight: copper sulfate pentahydrate, hydroxybutylidene diphosphonate, methylamino di methylene phosphonic acid, tripotassium citrate, trisodium citrate, polyethyleneimine, trimethyl borate, sodium hydroxide, glycerol, pyrophosphate, thiosulfate, sulfite, sodium dodecyl sulfate, 2-sodium ethyl-hexanol sulfate, sodium diethylhexyl sulfosuccinate, sodium phosphodiester and water. The copper plating solution for the plate roller is simple in preparation method, a prepared plating is high in brightness, hardness and wear resistance, no burr exists after the outer layer of the plate roller is combined with the plating, and the surface evenness and the weatherability are excellent.

Description

technical field [0001] The invention relates to a plate roller copper plating solution and a preparation method thereof. Background technique [0002] As a kind of printing process, gravure printing has the advantages of thick ink layer, bright color, high saturation, high printing plate durability, stable quality of printed products, fast printing speed and other advantages in the field of printing, packaging and graphic publishing. occupies an extremely important position. The plate roller is an important accessory in the plate-making processing industry. The plate-making process is used to process metal materials into various plate rolls with patterns, characters, and images. [0003] In recent years, modern electronic engraving gravure and laser engraving gravure printing are rapidly rising. Gravure printing has become a leader in the packaging and printing industry due to its large printing batch, bright colors and short printing process. The production of the gravure...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 张尚义蔡孟虎弓小军赵建合
Owner LONGYOU YUNSHEN PLATE MAKING CO LTD
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