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Manufacturing method of halogen-free, phosphorus-free, environment-friendly and flame-retardant paper-based copper clad laminate

A flame-retardant, copper-clad laminate technology, applied in chemical instruments and methods, paper/cardboard layered products, adhesive types, etc., can solve problems such as environmental pollution, high prices of phosphorus-containing compounds, and copper-clad laminates are susceptible to moisture, etc. Achieving the effect of cost reduction and heat resistance improvement

Active Publication Date: 2017-05-10
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the price of phosphorus-containing compounds is high, and the use of phosphorus-containing compounds to manufacture copper-clad laminates is susceptible to moisture, which affects heat resistance; nitrogen and phosphorus synergistically flame-retardant, and the combustion products contain a large amount of phosphorus-containing substances, causing pollution to the environment

Method used

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  • Manufacturing method of halogen-free, phosphorus-free, environment-friendly and flame-retardant paper-based copper clad laminate
  • Manufacturing method of halogen-free, phosphorus-free, environment-friendly and flame-retardant paper-based copper clad laminate

Examples

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Effect test

Embodiment 1

[0023] A method for preparing a halogen-free, phosphorus-free, environmentally friendly flame-retardant paper-based copper-clad laminate, the steps are as follows:

[0024] (1) Preparation of nitrogen-containing phenolic resin A: 20 parts of urea, 140 parts of melamine and 300 parts of concentration of 37wt% formaldehyde solution are dropped into the reactor successively, then adding 1 part of concentration is 25wt% sodium hydroxide solution, at 90 After reacting for 50 minutes under the condition of ℃, continue to add 70 parts of methanol with a concentration of 98%, and cool down to 45 ℃ to prepare a nitrogen-containing phenolic resin A with a nitrogen content of 20%.

[0025] (2) Preparation of nitrogen-containing phenolic resin B: 100 parts of phenol, 200 parts of 2,4-diamino-6-phenyl-1,3,5-triazine and 300 parts of formaldehyde solution with a concentration of 37 wt% were put into the reactor , then add 10 parts of oxalic acid aqueous solution with a concentration of 10%,...

Embodiment 2

[0031] A method for preparing a halogen-free, phosphorus-free, environmentally friendly flame-retardant paper-based copper-clad laminate, the steps are as follows:

[0032] (1) Preparation of nitrogen-containing phenolic resin A: 50 parts of urea, 260 parts of melamine and 500 parts of concentration of 37wt% formaldehyde solution are dropped into the reactor successively, then adding 3 parts of concentration is 25wt% Sodium hydroxide solution, at 100 After reacting at ℃ for 70 minutes, continue to add 100 parts of methanol with a concentration of 98%, and cool down to 15℃ to prepare nitrogen-containing phenolic resin A with a nitrogen content of 35%.

[0033] (2) Preparation of nitrogen-containing phenolic resin B: 150 parts of phenol, 300 parts of 2,4-diamino-6-phenyl-1,3,5-triazine and 500 parts of formaldehyde solution with a concentration of 37 wt% were put into the reactor , then add 10 parts of oxalic acid aqueous solution with a concentration of 15%, and react at 100°C ...

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Abstract

The invention belongs to the technical field of copper clad laminate production, and particularly relates to a manufacturing method of a halogen-free, phosphorus-free, environment-friendly and flame-retardant paper-based copper clad laminate. Brand-new nitrogen-containing phenolic resin is used in cooperation with other fillers, so that the flame retardancy, machinability and other basic performance of the copper clad laminate are ensured. In the manufactured copper clad laminate manufactured by the invention, the halogen content of chlorine is less than or equal to 0.09 percent, the content of bromine is less than or equal to 0.09 percent, and or the total content of the chlorine and the bromine is less than or equal to 0.15 percent, thereby meeting the requirement of freeness from halogen; moreover, no phosphorus-containing compound is added, and the phosphorus content is less than or equal to 0.1 percent. The flame retardancy of the manufactured copper clad laminate meets the FV0 grade requirement, the cost is lowered, and the heat resistance is enhanced greatly; the copper clad laminate is halogen-free, phosphorus-free and environment-friendly.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminate production, and in particular relates to a method for preparing a halogen-free, phosphorus-free, environment-friendly and flame-retardant paper-based copper-clad laminate. Background technique [0002] Copper clad laminates are widely used in the manufacture of printed circuit boards (referred to as PCBs) for various household appliances, electronic information products and industrial electronic products. As the substrate material of printed circuit boards, it plays the three major functions of carrying electronic components, forming conductive circuit patterns, and insulating between layers and lines. It is an important electronic basic material. [0003] The flame retardancy of CCL is one of the important safety performances of electronic products. Halogen-based flame-retardant materials (including Cl, Br) have been used in the printed circuit substrate industry for many years due ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B29/00B32B15/20B32B15/12B32B37/06B32B37/10C08G12/38C08G14/10C09J161/20C09J161/30C09J11/04C09J11/06
CPCB32B15/12B32B15/20B32B29/005B32B37/06B32B37/10B32B2260/028B32B2260/046B32B2307/3065B32B2457/08C08G12/38C08G14/10C08K3/22C08K5/05C08K5/34924C08K2003/2227C09J11/04C09J11/06C09J161/20C09J161/30
Inventor 陈长浩李宝东朱义刚秦伟峰陈晓鹏王卫兴杨永亮姜晓亮朱琪琪李洪学
Owner SHANDONG JINBAO ELECTRONICS
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