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A system and method for layered milling of multi-layer materials based on spatially combined laser focus

A technology of space combination and milling processing, which is applied in metal processing, laser welding equipment, metal processing equipment, etc., can solve problems such as low efficiency, and achieve the effect of high-efficiency, high-precision, and high-quality laser drilling

Active Publication Date: 2018-02-16
张立国
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the laser defocusing time far exceeds the laser drilling time, it is a very inefficient but helpless way to remove the insulating material layer of the circuit board from the laser focus defocusing

Method used

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  • A system and method for layered milling of multi-layer materials based on spatially combined laser focus
  • A system and method for layered milling of multi-layer materials based on spatially combined laser focus
  • A system and method for layered milling of multi-layer materials based on spatially combined laser focus

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Embodiment 1

[0079] Embodiment 1. A multi-layer material layered milling and drilling system based on spatially combined laser focus. Combine below Figure 1-Figure 3 The system provided in this embodiment will be described in detail.

[0080] see figure 1 , the multi-layer material layered milling and drilling system based on spatially combined laser focus provided in this embodiment includes a window milling laser 1, a selective milling laser 2, a laser beam combiner 5, and a laser focusing and focus switching module 8;

[0081] The window milling laser 1 is used to generate the first window milling laser beam 11, and enter the laser beam combiner 5;

[0082] The selected milling laser 2 is used to generate a first selected milling laser beam 21, and enter the laser beam combiner 5;

[0083] The laser beam combiner 5 is used to combine the incident first window milling laser beam 11 and the first selected milling laser beam 21, and output the second window milling laser beam 6 and Th...

Embodiment 2

[0101] It can be seen from the above-mentioned embodiment 1 that the focal point of the window-opening milling laser and the focal point of the selected milling laser constitute a spatially combined laser focal point (not marked in the figure). On the basis of the above-mentioned embodiment 1, the focal point of the selected milling laser can be selected in this embodiment. It is further designed to distribute the laser focus with a flat top. please see Figure 4 , the beam shaper 3 is set between the selected milling laser 2 and the laser beam combiner 5, so that the corresponding selected milling laser focus transverse field strength distribution is a flat-top spot distribution. The advantage of this design is that the flat-top laser is very conducive to high efficiency The high-quality milling process makes the bottom of the blind hole clean and the cleaning efficiency is extremely high.

[0102] In addition, in this embodiment, a laser fine modulation motion module 2 can ...

Embodiment 3

[0112] Embodiment 3. A layered milling method for multi-layer materials based on spatially combined laser focus.

[0113] see Figure 5 , the method provided in this embodiment specifically includes:

[0114] S1, the first window milling laser beam generated by the window milling laser and the first selected milling laser beam generated by the selective milling laser enter the laser beam combiner respectively;

[0115] S2, the laser beam combiner combines the first window milling laser beam and the first selected milling laser beam, outputs the second window milling laser beam and the second selected milling laser beam transmitted in parallel in the same direction, and incident Laser focusing and focus switching module;

[0116] S3, the laser focusing and focus switching module focuses the second windowing milling laser beam and the second selected milling laser beam traveling in parallel in the same direction to obtain a spatially combined laser focusing focus, and controls...

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Abstract

The invention discloses a multilayer material layered milling and drilling system and drilling method based on spatially combined laser focus. The milling and drilling system includes a window milling laser, a selective milling laser, a laser beam combiner, and laser focusing and focus switching The module realizes the laser focus and focus switching module under the same drilling optical focusing system, which sets the space combined laser focus. When processing multi-layer thin sheets of different materials, the laser focus with different characteristics can be used for processing Different layers of materials, which can greatly improve laser processing efficiency and laser processing quality, especially when processing blind hole drilling of multi-layer sheets of different materials, and when milling materials with a low laser damage threshold in the last layer of blind holes , the material is removed by selecting the focus of the milling laser, without worrying about damaging the next layer of laser damage threshold material, which brings a good process stability range, saves processing time, improves processing efficiency, and obtains good processing results.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a multilayer material layered milling processing system and method based on spatially combined laser focus. Background technique [0002] The current blind hole drilling of ultraviolet laser circuit boards belongs to the difficult field of laser processing. Generally, PCB boards, especially flexible circuit boards, are made of multi-layer materials. The laser needs to be in a very small dimension (usually within 10 mm). Remove the copper skin and the insulating layer under the copper skin without damaging the bottom copper of the next layer, and the hole wall is required to be smooth, and the surface copper skin is not lifted, and high-speed drilling is required. At present, it is known that all UV laser PCB blind hole drilling, when removing the insulating layer between the copper skins, mainly removes materials such as polyimide, and all adopt the method of laser focus...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/386B23K26/06B23K26/046B23K26/0622B23K26/073B23K26/082B23K101/42
CPCB23K26/046B23K26/0608B23K26/0622B23K26/073B23K26/082B23K26/389B23K2101/42
Inventor 张立国
Owner 张立国
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