Optical system for laser precision slotting and slotting method

Abstract

The invention discloses an optical system for laser precision slotting and a slotting method. The optical system comprises a laser device, a first reflector group, a first half-wave plate, a wedge-shaped mirror, a second beam splitter prism for uniformly splitting a light beam processed by the wedge-shaped mirror into a first light beam and a second light beam with equal energy, a second reflectorgroup for reflecting the first light beam to a first beam combining prism, a first galvanometer unit for polarizing the second light beam and then emitting the second light beam into the first beam combining prism, a second half-wave plate for modulating the polarization state of the light beam emitted by the first beam combining prism, a third beam splitting prism for uniformly splitting the light beam into four laser beams, a third reflector group for reflecting two of the four laser beams into a second beam combining prism, a second galvanometer unit for performing polarization processingon the other two laser beams and then emitting the laser beams into the second beam combining prism, and a laser focusing unit. The phenomena of edge breakage and raised grains are reduced, so that the groove boundary contour is clear, and corners are basically not overburnt.

Description

【Technical field】 [0001] The invention belongs to the technical field of laser grooving, in particular to an optical system and a grooving method for laser precision grooving. 【Background technique】 [0002] Using laser characteristics to process core devices such as electronic chips has become a new fashion in the entire industry. Wafer is an indispensable part of electronic chips and integrated circuits, and its processing accuracy is directly related to the strength, stability, and electrical properties of the wafer. The thickness of the wafer is getting thinner and thinner, and the ultimate wafer thickness can be as low as 20um, which has caused some traditional wafer grooving technologies to reach the bottleneck. Traditional grooving technologies mainly include ultraviolet nanosecond laser grooving technology and diamond grooving technology. Both of these technologies have adverse phenomena such as edge chipping, wavy lines, unclear groove boundary contours, and corner...

AI Technical Summary

Problems solved by technology

The thickness of the wafer is getting thinner and thinner, and the ultimate wafer thickness can be as low as 20um, which has caused some traditional wafer grooving technologies to reach the bottleneck

Traditional grooving technologies mainly include UV nanosecond laser grooving technology and diamond grooving technology, both of which have adverse phenomena such as edge chipping, wavy lines, unclear groove boundary contours, and corner ablation.

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