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Resin composition for forming cured film

A technology of resin composition and cured film, applied in the direction of coating, can solve the problems of complicated process and cost, and achieve the effect of excellent flexibility, excellent resistance and high hardness

Active Publication Date: 2017-03-22
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, patterning by photolithography has the problem of not only complicated steps but also high costs.

Method used

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  • Resin composition for forming cured film
  • Resin composition for forming cured film
  • Resin composition for forming cured film

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0107] [Preparation method of composition]

[0108] The method for preparing the composition of the present invention is not particularly limited. As an example, the method of dissolving the component (A) in the solvent (D) and mixing the components (B) and (C) in an arbitrary order in a predetermined ratio in this solution to prepare a uniform solution . Moreover, the manufacturing method which further adds (E)-(I) component and other components as needed in the appropriate stage of this manufacturing method, and mixes it is mentioned. The cured film-forming resin composition in a solution state prepared in this way is preferably used after filtration using a filter having a pore diameter of about 0.2 μm or the like.

[0109] [Coated film and cured film]

[0110] Printing by using spin coating, flow coating, roll coating, slit coating, slit next spin coating, inkjet coating, screen printing, flexographic printing, gravure printing, offset printing, gravure offset printing,...

Embodiment 1

[0131] 41.5 g of CYCLOMER-P, 9.8 g of PET-30, 9.8 g of CYMEL303, 0.6 g of PERBUTYL L, 0.2 g of UPS, and 37.5 g of DEGEEA were charged in a 200 mL container. This was put into a stirring apparatus, and it stirred at 2,000 rpm for 10 minutes, and the composition (varnish) was produced.

Embodiment 2

[0133] 33.5 g of CYCLOMER-P, 11.8 g of PET-30, 11.8 g of CYMEL303, 0.5 g of PERBUTYL L, 0.2 g of UPS, and 42.2 g of DEGEEA were charged in a 200 mL container. This was put into a stirring apparatus, and it stirred at 2,000 rpm for 10 minutes, and the composition (varnish) was produced.

[0134] [2] Manufacture and evaluation of cured film

[0135] [2-1] Measurement of light transmittance

[0136] The varnishes of Examples 1 and 2 were respectively coated on quartz glass substrates by spin coating, and prebaked at 110° C. for 2 minutes. Next, post-baking was performed at 230° C. for 30 minutes to prepare a cured film with a thickness of 2 μm.

[0137] Then, the light transmittance in wavelength 400nm of each obtained cured film was measured. It should be noted that the light transmittance of the quartz glass substrate used was 93.8%.

[0138] [2-2] Evaluation of pencil hardness and adhesion

[0139] The varnishes of Examples 1 and 2 were respectively applied on glass subst...

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Abstract

Provided is a resin composition for forming a cured film, the resin composition including (A) a copolymer containing monomer units represented by formulas (1) and (2), (B) a melamine crosslinking agent, (C) a thermal radical polymerization initiator, and (D) a solvent. (In the formulas, R1 each independently represent a hydrogen atom or methyl group. R2 represents a hydrogen atom or C1-5 alkyl group. R3 represents a hydrogen atom or methyl group.)

Description

technical field [0001] This invention relates to the resin composition for cured film formation. Background technique [0002] Conventionally, protective films, insulating films, and the like required for touch panels and the like have been formed at necessary locations by patterning using photolithography using a photosensitive resin composition (Patent Document 1). [0003] However, patterning by photolithography has a problem of not only complicated steps but also high costs. Therefore, there is a demand for a composition capable of forming a protective film, an insulating film, and the like at necessary locations using a more simple method and at low cost. [0004] In addition, as shown in Patent Document 2, when an ITO film is formed by sputtering on an insulating film, cracks or the like may occur due to a stress difference between the insulating film and the ITO film. For such a protective film and an insulating film, Resistance to sputtering of ITO also becomes nec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D133/14C08F8/14C08K5/3492C08L33/14C09D7/12
CPCC08F8/14C09D133/14C08K5/3492C08L33/14C09D7/40C09D7/63C08K5/34922C08K5/5415C08L33/04C09D133/04C08K5/10
Inventor 服部隼人
Owner NISSAN CHEM IND LTD
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