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Earphone wire forming method

A molding method and technology for earphone cables, applied in electrical components, circuits, insulating conductors/cables, etc., can solve problems such as increased cost, inability to cover, complex manufacturing process, etc., to improve product yield and production efficiency, avoid Damage or core wire contact, the effect of reducing the difficulty of the process

Active Publication Date: 2017-03-22
SHENZHEN CANNICE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The earphone wire made by the above process has the following disadvantages. First, multiple injection molding is required, and its manufacturing process is complicated.
Second, silicone injection molding needs to be carried out under high temperature and high pressure conditions, which is easy to melt the insulating paint layer and cause contact between core wires, resulting in electrical signal interference
3. A single enameled wire cannot be coated with thin silica gel, but all the wire cores can only be coated after forming a bundle (because the silica gel needs to be formed at high temperature, the enameled wire cannot be coated with a soft rubber protective layer that is not resistant to high temperature). The friction between the cores, the resulting interference makes the horn show obvious noise
Fourth, the enameled wire is easy to disperse without a protective layer, and the outer layer of silica gel is easily broken by the mold when it is formed.
Five, the silicone material is easy to get dusty, spraying rubber oil can improve it, but it will further increase the cost
Sixth, the self-demolition edge of the silicone product obviously delaminates the surface of the wire, and the appearance of the whole line is not good

Method used

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Embodiment Construction

[0019] In order to make the purpose, technical solutions and advantages of the invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the invention Examples, not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] Such as figure 1 and figure 2 As shown, the present invention provides an embodiment of an earphone wire forming method.

[0021] The earphone cable forming method includes the following steps: performing a wire shaping step on the cut wire rod, and the wire rod shaping step includes first performing a presetting step S10 on a suitable length of the wire rod, so that the...

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PUM

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Abstract

The invention is suitable for the technical field of an earphone. The invention discloses an earphone wire forming method which comprises a wire shaping step on a cut wire which comprises a wire middle layer that wraps an enameled stranded wire and a wire outer layer that wraps the wire middle layer. The wire shaping step comprises processes of performing pre-shaping on the wire with an appropriate length so that the wire is preset to a required shape; and performing heating forming, namely performing heating forming on the pre-shaped wire. Because pre-shaping is performed on the wire and the pre-shaped wire is placed into boiled water or a baking furnace for performing baking for further shaping, a controllable heating temperature is realized. Not only can secondary injection molding forming in a high-temperature high-pressure mold be saved for preventing production process increase, but also core wire damage or core wire contact caused by the high temperature and high pressure in secondary injection molding forming can be prevented. Furthermore the earphone wire forming method has advantages of improving quality of an earphone wire, reducing process difficulty, and improving product yield rate and production efficiency.

Description

technical field [0001] The invention relates to the technical field of manufacturing earphone products, in particular to a method for forming earphone wires. Background technique [0002] When the existing earphone wire is made, the first step is to draw the copper wire, that is, to make the copper rod pass through the mold (roller) under the action of external force to obtain the copper wire of the required size, such as a diameter of The second step is copper wire annealing, that is, when the copper wire is heated to a certain temperature, the toughness of the copper wire is improved and the strength of the copper wire is reduced by recrystallization; the third step is the conductor stranding, using 14 The copper wires are stranded in a bundle to meet the electrical performance requirements; the fourth step is to dip and coat the insulating varnish to complete the enamelled stranded wire; the fifth step is to extrude and coat the silicone wire, and use a silicone extrude...

Claims

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Application Information

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IPC IPC(8): H01B13/00H01B13/14H01B13/24
CPCH01B13/00H01B13/141H01B13/143H01B13/24
Inventor 郭霞云
Owner SHENZHEN CANNICE TECH
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