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A height-limited solder preform

A preformed solder sheet and solder sheet technology, which is applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problem of difficulty in controlling the thickness of the metal alloy layer with uniform size, poor uniformity of solder layer thickness, and different degrees of dissolution and other problems, to achieve the effect of simple and easy welding conditions, fast welding speed and less residue

Active Publication Date: 2020-12-15
SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the solder preform is put into the high melting point metal particles in the molten state of the solder. The metal particles will be eroded at high temperature. The degree of dissolution of different particles and different batches is different. The size uniformity of the final particles and the thickness of the metal alloy layer are different. It is difficult to control, making the uniformity of the thickness of the welding layer poor, so it is only used in occasions where the thickness of the welding layer is not high

Method used

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  • A height-limited solder preform
  • A height-limited solder preform

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Such as figure 1 As shown, the solder preform with limited high performance of the present invention includes a solder base 1, a metal wire 2 and a flux layer 3;

[0037] The solder lug base 1 is a cuboid with length×width×thickness=6mm×6mm×0.2mm; one length×width surface of the solder lug base 1 is provided with two grooves parallel to the wide side 12, the concave The cross section of the groove is square, the length, width and depth of the groove are 6mm, 0.1mm and 0.1mm respectively, the metal wire is copper wire, the size of the metal wire 2 is the same as the groove, and it can just be embedded in the groove Fixed.

[0038] A layer of flux layer 3 with a thickness of 0.01-0.02 mm is coated on the surface of the solder chip substrate 1 embedded with the metal wire 2 .

[0039] Specifically, the flux composition of the flux layer 3 is: 1.5-2.5 parts of succinic acid, 1-2 parts of malonic acid, 1.5-3 parts of dibromobutenediol, 0.5-3 parts of triethanolamine hydroc...

Embodiment 2

[0043] Such as figure 1 As shown, the solder preform with limited high performance of the present invention includes a solder base 1, a metal wire 2 and a flux layer 3;

[0044] The solder lug base 1 is a cuboid with length×width×thickness=15mm×15mm×0.5mm; two grooves parallel to the wide side 12 are opened on a length×width surface of the solder lug base 1, and the concave The cross section of the groove is square, the length, width and depth of the groove are 15mm, 0.35mm and 0.35mm respectively, the metal wire is silver wire, and the size of the metal wire 2 is the same as that of the big and small grooves, which can just fit into the groove Fixed.

[0045] A layer of flux layer 3 with a thickness of 0.005-0.01 mm is coated on the surface of the solder chip substrate 1 embedded with the metal wire 2 .

[0046] Specifically, the composition of the flux layer 3 is: 1.5-2.5 parts of succinic anhydride, 3.8-4.5 parts of glutaric acid, 2.5-3 parts of dibromobutenediol, 0.8-1 p...

Embodiment 3

[0049] Such as figure 2 As shown, the solder preform with limited high performance of the present invention includes a solder base 1, a metal wire 2 and a flux layer 3;

[0050] The solder lug base 1 is a cuboid with length×width×thickness=20mm×20mm×0.3mm; one length×width surface of the solder lug base 1 is provided with four grooves parallel to the wide side 12, the concave The cross section of the groove is circular, the length, width and depth of the groove are 10mm, 0.15mm and 0.15mm respectively, the metal wire is a copper-silver alloy wire, the diameter of the metal wire 2 is 0.15mm, and the length is 10mm, and Embedded in the groove fixed.

[0051] A layer of flux layer 3 with a thickness of 0.02-0.03 mm is coated on the surface of the solder chip substrate 1 embedded with the metal wire 2 .

[0052] Specifically, the composition of the flux layer 3 is: 2.5-3 parts of glutaric acid, 4-5 parts of suberic acid, 1-1.5 parts of dibromosuccinic acid, 0.5-1 part of dietha...

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Abstract

The invention relates to the technical field of soldering materials and particularly discloses a height-limited type solder preform. The height-limited type solder preform comprises a solder preform matrix and metal wires. The solder preform matrix is in a cuboid shape. One length*width surface of the solder preform matrix is provided with at least two grooves parallel to the width edge of the surface. The length of each groove is equal to that of the width edge of the surface. The depth of each groove is smaller than that of the solder preform. The dimensions of each metal wire are equal to that of each groove, and each metal wire can be just embedded into the corresponding groove to be fixed. The melting point of each metal wire is 300 DEG C or above higher than that of the solder preform matrix. The preparation process of the height-limited type solder preform is simple and easy to operate. The height-limited type solder preform is low in cost, stable in soldering thickness, high in uniformity, low in voidage, and particularly suitable for high-reliability soldering having a certain requirement for the height of a solder layer in the process of electronic packaging.

Description

technical field [0001] The invention relates to the technical field of soldering materials, in particular to a height-limited solder preform, especially suitable for high-reliability soldering with certain requirements on the height of the solder layer in electronic packaging. Background technique [0002] Solder preform is a kind of precision-shaped solder that can be made into different shapes, sizes and surface shapes according to requirements. It is suitable for various product manufacturing processes with small tolerances. It is widely used in printed circuit board (PCB) assembly, connectors And terminal equipment, chip connection, power module substrate attachment, filter connector and electronic component assembly and other fields. Solder preforms are usually used in occasions that have special requirements on the shape and quality of the solder, and can be made into any size and shape to meet customer needs. Solder preforms have the advantages of diverse shapes, goo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/02B23K35/26B23K35/362
CPCB23K35/0233B23K35/262B23K35/362
Inventor 赵锦业马春成侯昌桂黄耀林蔡烈松
Owner SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD
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