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Deplating liquid of TiNC film and deplating process

A deplating solution and process technology, applied in the field of deplating solution and deplating process of TiNC film, can solve the problems of equipment and workshop hazards, poor safety, substrate corrosion, etc., achieve non-toxic side effects, suitable treatment degree and treatment speed Effect

Active Publication Date: 2017-02-22
中山骏业佳安特电器有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the traditional deplating process, the deplating solution contains substances with strong oxidizing properties such as nitric acid, cyanide, nitro compound sulfuric acid, poor safety and serious pollution.
In addition, the substrate itself is easily corroded during the deplating process, and toxic or harmful gases are produced to pollute the environment
And part of the copper will react with nitric acid to produce polluting NO X Gas, not only has great harm to human body, but also has certain harm to equipment and workshop

Method used

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  • Deplating liquid of TiNC film and deplating process
  • Deplating liquid of TiNC film and deplating process
  • Deplating liquid of TiNC film and deplating process

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] The embodiment of the present invention provides a kind of stripping solution of TiNC film, the solvent of described stripping solution is deionized water or distilled water, each component and content thereof of the solute of described stripping solution include:

[0025]

[0026] The deplating solution for the TiNC film provided by the embodiment of the present invention has no toxic and side effects. When deplating the workpiece, not only the TiNC film on the surface of the workpiece can be completely removed, but also the substrate of the workpiece will not be damaged. During the deplating treatment, sodium chlo...

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Abstract

The invention is suitable for the technical field of film plating treatment, and provides deplating liquid of a TiNC film. A solvent of the deplating liquid is de-ionized water or distilled water; and a solute of the deplating liquid comprises the following components and contents: 1-6 g / L of ammonium chloride, 0.01-0.5 g / L of cerium chloride, 5-30 g / L of surface active agent, 3-35 g / L of corrosion-resistance complexing agent, and 1-30 g / L of corrosion inhibitor. The invention further provides a deplating process of the deplating liquid of the TiNC film. The deplating liquid of the TiNC film has no poison and side effect. When a workpiece is deplated, the deplating liquid not only can thoroughly remove the TiNC film on the surface of the workpiece, but also cannot damage a substrate of the workpiece.

Description

technical field [0001] The invention belongs to the technical field of coating treatment, and in particular relates to a deplating solution and a deplating process of a TiNC film. Background technique [0002] Unqualified coatings will be produced during the coating process and need to be recycled. This requires the complete removal of the coating on the surface of the substrate, and the deplating solution is usually suitable for the removal of the coating on the surface of the substrate. In the traditional deplating process, the deplating solution contains substances with strong oxidizing properties such as nitric acid, cyanide, nitro compound sulfuric acid, poor safety and serious pollution. In addition, the substrate itself is easily corroded during the deplating process, and toxic or harmful gases are produced to pollute the environment. And part of the copper will react with nitric acid to produce polluting NO X Gas, not only has great harm to human body, but also has...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23G1/26
CPCC23G1/26
Inventor 向雄志胡远立程淼黄琪
Owner 中山骏业佳安特电器有限公司
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