A mixed-pressure metal-based microwave printed board and its design method

A metal-based, printed board technology, applied in the directions of printed circuits, printed circuits, printed circuit components, etc., can solve the problem of difficult to meet the requirements of high power and large heat flow density, reduce the wiring space of the signal line of the radio frequency layer, and affect the radio frequency ground. Plane integrity and other issues, to optimize the heat dissipation effect of the circuit, avoid the deterioration of transmission performance and processing difficulties, and facilitate the effect of metal-based structures

Active Publication Date: 2019-02-12
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing microwave printed boards have the following disadvantages: 1. The high-frequency board is placed on the outer layer, and the microwave signal is transmitted using a microstrip line structure, which has a large signal loss and is prone to electromagnetic compatibility problems; 2. Assembled on the surface of the printed board The wiring vias of the component control lines and power lines need to pass through the RF signal wiring layer, which affects the integrity of the RF ground plane and reduces the wiring space for the signal line of the RF layer; 3. The cost of pure high-frequency boards is relatively high; 4 , Printed boards without metal base, the heat dissipation effect is not ideal, it is difficult to meet the requirements of high power and large heat flux density

Method used

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  • A mixed-pressure metal-based microwave printed board and its design method
  • A mixed-pressure metal-based microwave printed board and its design method

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Experimental program
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Effect test

Embodiment 1

[0039] The metal-based printed board is processed by the PCB manufacturing process from a high-frequency laminated structure (including a high-frequency core board and a high-frequency adhesive sheet), a low-frequency laminated structure (including a low-frequency core board and a low-frequency adhesive sheet), and a metal base.

[0040] The low-frequency core board in the low-frequency laminated structure is used for low-frequency wiring, and the high-frequency core board in the high-frequency laminated structure is used for high-frequency wiring. The interlayer interconnection of radio frequency signals adopts a blind hole structure, which only penetrates the high-frequency stacked structure and avoids passing through the low-frequency structure. The low-frequency laminated structure adopts a blind hole structure, which mainly penetrates the low-frequency core board and the low-frequency adhesive sheet, and avoids passing through the high-frequency laminated structure as much...

Embodiment 2

[0049] A 16-layer board is designed, see the structure figure 2 . figure 2 Among them, 21 is a low-frequency core board, 22 is a low-frequency adhesive sheet, 23 is a high-frequency adhesive sheet, 24 is a high-frequency core board, 25 is an adhesive sheet, 26 is a metal base, 27 and 28 are sidewall metallized blind Grooves, 29 and 30 are metallized vias, and 31 and 32 are components. The number of wiring layers of the printed board is 16. L_1, L_2, L_3, ..., L_16 in sequence.

[0050] The dielectric constant of the selected low-frequency core board and low-frequency bonding sheet is 4.5, the dielectric constant of the high-frequency core board and high-frequency bonding sheet is 2.9, the metal base material is copper, and the bonding between the high-frequency material and the copper base is The sheet is conductive glue. The thickness of the high and low frequency boards after lamination is 3.0mm (excluding the metal base), and the thickness of the finished board after ...

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Abstract

The invention relates to structural design of printed boards, provides a mixed-lamination metal-based microwave printed board and design method thereof, and aims at solving problems in the prior art. An RF transmission line connected with a device pin is of a microstrip line structure, and is changed to a band-shaped line structure after short-distance impedance match, and most RF signals are transmitted in a high-frequency material layer via the band-shaped line structure. Heat generated by the device transmitted to the metal base via plated through holes in the printed board, and the metal base assists in heat radiation. N low-frequency core plates are laminated into a low-frequency laminated structure via N-1 low-frequency bonding sheets; M high-frequency core plates are laminated into a high-frequency laminated structure via M-1 high-frequency bonding sheets; a metal-base-free printed board is laminated between the low-frequency laminated structure and the high-frequency laminated structure via the high-frequency bonding sheets; and the high-frequency core plate in the outmost layer of the metal-base-free printed board and the metal base are laminated into the final metal-base printed board via thermo-conductive and conductive bonding sheets.

Description

technical field [0001] The invention relates to the structural design of a printed board, in particular to a mixed-pressure metal-based microwave printed board and a design method. Background technique [0002] With the development of electronic technology, the integration of microwave circuits is getting higher and higher, the heat generation is getting bigger and bigger, and the frequency of transmission signals is getting higher and higher, so that more and more requirements are put forward for microwave printed boards in terms of radio frequency performance, heat dissipation effect and cost performance. demanding. [0003] The existing microwave printed boards have the following disadvantages: 1. The high-frequency board is placed on the outer layer, and the microwave signal is transmitted using a microstrip line structure, which has a large signal loss and is prone to electromagnetic compatibility problems; 2. Assembled on the surface of the printed board The wiring vi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0206H05K1/0236H05K1/0295H05K2201/0195
Inventor 肖昌怡刘港陈东
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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