The method to eliminate the low temperature failure of the anti-skid brake control device

Abstract

The invention provides a method for clearing a low-temperature failure of an anti-skid brake control device. According to the device, a large-power component is adjacent to a small-power component, heat is supplied to the small-power component under a low-temperature condition, every row of large-power components are opposite to a row of small-power components. After physical analysis on a failure, the reason of the low-temperature solder-point cracking is uncompacted solder packing, and a soldering technique is determined against the uncompacted solder packing to clear the solder-point cracking failure. Insulating paint for preventing condensation is coated to avoid short circuit or breakdown; micro-crack generated by plastic deformation can be controlled by adopting a method for increasing the bent radius of a pin, and the failure can be cleared. By adopting the device, the low-temperature resistance of an anti-skid brake control device can be improved under a condition of not changing the existing material of a shell or changing the quality grade of components, so that the aims of prolonging the service life of the anti-skid brake control device and reducing product waste and resource consumption can be achieved when the anti-skid brake control device works at 55 DEG C below zero and has a temperature of 45 DEG C below zero.

Description

technical field [0001] The invention relates to the field of low-temperature failure analysis of civil transportation aircraft electronic products, in particular to a structural improvement of the low-temperature weak link of an anti-skid brake control device by using computer technology. Background technique [0002] The anti-skid brake control device is an accessory in the electronic anti-skid brake system of the aircraft. It is powered by the aircraft, receives the electrical signal sensed by the wheel speed sensor, and controls the brake pressure during the landing anti-skid brake process. It can complete normal landing anti-skid brake control, take-off line brake control, inter-wheel protection control, touchdown protection control, and wheel stop brake function after the landing gear is retracted. [0003] Since the minimum ambient temperature of electronic components is -55°C, when the ambient temperature reaches -55°C, the heat generated by some electronic components...

AI Technical Summary

Problems solved by technology

[0028] In order to overcome the existing technology in the low-temperature design of electronic products, the plate-type sealed shell cannot take into account the temperature rise caused by high temperature, and the increase of heating resistance will cause high-temperature damage to electronic products under high-temperature conditions, and avoid the need to reinstall electronic equipment in the low-temperature area of ​​the aircraft. Insufficiency of balanced design, the present invention proposes a method to eliminate low temperature failure of the anti-skid brake control device

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