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Silica gel cooling fin

A heat sink, silica gel technology, applied in the field of silica gel heat sink, to achieve the effect of enhanced thermal conductivity, not easy to scorch, and good quality

Inactive Publication Date: 2017-01-04
强新正品(苏州)环保材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a silicone heat sink that is not prone to problems such as scorching, whitening, and too long vulcanization time during the preparation process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A silicone heat sink, comprising the following components by weight: 50 parts of methyl vinyl polysiloxane mixture, 50 parts of silane coupling agent, 5 parts of silicon dioxide, 0.1 part of platinum catalyst, and 0.01 part of alcohol retarder , 10 parts of aluminum hydroxide, 0.1 part of peroxide, 30 parts of thermally conductive powder, 1 part of heat stabilizer and 1 part of antioxidant.

[0018] The thermally conductive powder includes one or more of aluminum oxide, magnesium oxide, aluminum nitride and boron nitride.

[0019] The thermally conductive powder includes alumina and boron nitride, and the weight ratio of the alumina and boron nitride is 3:1.

[0020] The alumina includes micron alumina and the boron nitride includes micron boron nitride.

[0021] The silane coupling agent includes epoxy silane coupling agent or amino silane coupling agent.

[0022] The platinum catalyst includes KE-808.

[0023] The silica includes fumed silica.

[0024] The antioxi...

Embodiment 2

[0027] A silicone heat sink, comprising the following components by weight: 60 parts of methyl vinyl polysiloxane mixture, 60 parts of silane coupling agent, 10 parts of silicon dioxide, 0.3 part of platinum catalyst, and 0.03 part of alcohol retarder , 15 parts of aluminum hydroxide, 0.5 parts of peroxide, 40 parts of thermally conductive powder, 5 parts of heat stabilizer and 5 parts of antioxidant.

[0028] The thermally conductive powder includes one or more of aluminum oxide, magnesium oxide, aluminum nitride and boron nitride.

[0029] The thermally conductive powder includes aluminum oxide and boron nitride, and the weight ratio of the aluminum oxide and boron nitride is 5:1.

[0030] The alumina includes micron alumina and the boron nitride includes micron boron nitride.

[0031] The silane coupling agent includes epoxy silane coupling agent or amino silane coupling agent.

[0032] The platinum catalyst includes KE-808.

[0033] The silica includes fumed silica.

...

Embodiment 3

[0037] A silicone heat sink, comprising the following components by weight: 55 parts of methyl vinyl polysiloxane mixture, 60 parts of silane coupling agent, 8 parts of silicon dioxide, 0.2 part of platinum catalyst, and 0.02 part of alcohol retarder , 12 parts of aluminum hydroxide, 0.3 parts of peroxide, 35 parts of thermally conductive powder, 2 parts of heat stabilizer and 3 parts of antioxidant.

[0038] The thermally conductive powder includes one or more of aluminum oxide, magnesium oxide, aluminum nitride and boron nitride.

[0039] The thermally conductive powder includes aluminum oxide and boron nitride, and the weight ratio of the aluminum oxide and boron nitride is 4:1.

[0040] The alumina includes micron alumina and the boron nitride includes micron boron nitride.

[0041] The silane coupling agent includes epoxy silane coupling agent or amino silane coupling agent.

[0042] The platinum catalyst includes KE-808.

[0043] The silica includes fumed silica.

[...

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PUM

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Abstract

The invention discloses a silica gel cooling fin. The silica gel cooling fin is characterized in that the silica gel cooling fin comprises the following components in parts by weight: 50 to 60 parts of methyl vinyl polysiloxane mixture, 50 to 60 parts of silane coupling agent, 5 to 10 parts of silicon dioxide, 0.1 to 0.3 part of platinum catalyst, 0.01 to 0.03 part of alcohol retarder, 10 to 15 parts of aluminum hydroxide, 0.1 to 0.5 part of peroxide, 30 to 40 parts of heat conducting powder, 1 to 5 parts of heat stabilizer and 1 to 5 parts of antioxidant. The silica gel cooling finprovided by the invention avoids the problems of scorching, whitening, long vulcanizing time and the like in a preparation process, the quality of the silica gel cooling fin is good and the rate of finished products is high.

Description

technical field [0001] The invention relates to a silica gel heat sink, which belongs to the technical field of heat conducting materials. Background technique [0002] Silicone heat sink is a thermal conductive medium used to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat sink. The existing silicone heat sink is prone to problems such as scorching, whitening, and excessive vulcanization time during the preparation process, which seriously affects the quality of the silicone heat sink, and the yield is low. SUMMARY OF THE INVENTION [0003] The technical problem to be solved by the present invention is to provide a silica gel heat sink which is not prone to problems such as scorching, whitening, and excessive vulcanization time during the preparation process. [0004] In order to solve the above-mentioned technical problems, the technical scheme adopted in the present invention is: [0005] A silicone heat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K13/02C08K3/22C08K3/28C08K3/38C08K5/5435C08K5/544
CPCC08K13/02C08K3/22C08K3/28C08K3/38C08K5/5435C08K5/544C08K2003/222C08K2003/2227C08K2003/2241C08K2003/282C08K2003/385C08K2201/011C08K2201/014C08L2201/08C08L83/04
Inventor 闫森源
Owner 强新正品(苏州)环保材料科技有限公司
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