Insulating plate in stable form and manufacturing method thereof

Abstract

The invention discloses an insulating plate in a stable form. The insulating plate is prepared from the following materials by mass percent: 40% to 55% of epoxy resin, 5% to 10% of dimethylaminopropylamine, 10% to 25% of polypropylene glycol diglycidyl ether, 1% to 3% of triethanolamine, 10% to 25% of tetrabromobisphenol A, 0.5% to 5% of tetrabutyl titanate, 0.3% to 3% of 1,4-cyclohexanedimethanol, 0.2% to 2% of 1,3,5-cyclohexanetriol, 0.3% to 3% of glycerol, 0.2% to 3% of pentaerythritol, 1% to 5% of talcum powder, 0.1% to 2% of maleic anhydride and 0.1% to 2% of polypropylene. According to the insulating plate, a conventional epoxy resin insulating plate is modified, the maleic anhydride and styrene which are used for improving the toughening performance are added, and additionally, a proper amount of talcum powder is added, so that the deformation of the insulating plate due to heating or cooling is reduced.

Description

technical field [0001] The invention belongs to the field of electronic insulating materials, in particular to a form-stable insulating plate and a manufacturing method thereof. Background technique [0002] Epoxy insulating board generally refers to organic polymer compounds containing two or more epoxy groups in the molecule. Except for a few, their relative molecular weight is not high. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can undergo cross-linking reactions with various types of curing agents to form insoluble, infusible high polymers with a three-dimensional network structure. [0003] Epoxy resin insulation boards are widely used in the electrical field, and epoxy resin insulation boards used in electrical equipment are prone to large deformatio...

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Problems solved by technology

[0003] Epoxy resin insulation boards are widely used in the electrical field, and epoxy resin insulation boards used in electrical equipment are prone to large deformation due to the influence of equipment heat, and usually cause expansion or contraction, which makes the insulation The cracking of the board will destroy the insulation structure, which will lead to the decline of the insulation performance of the insulation board, and even cause the failure of electrical equipment and endanger personal safety.

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