Polyurethane foam with heat conductivity coefficient enhanced by hollow glass beads
A technology of hollow glass microspheres and polyurethane foam, applied in polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve problems such as unsatisfactory safety, low production efficiency, and poor heat resistance , to achieve good heat insulation effect, high sealing bond strength, and excellent flame retardant effect
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[0014] A polyurethane foam with enhanced thermal conductivity by hollow glass microspheres, made of the following raw materials in parts by weight (kg): 150 diphenylmethane diisocyanate, 100 trihydroxypolyoxypropylene ether, 100 castor oil, and glycerin 5. Diethyl phosphate 40, an appropriate amount of 1mol / L sodium hydroxide solution, diatomaceous earth 13, distilled water 5, triethanolamine 2, dibutyltin dilaurate 3, polyacrylamide 4, fatty alcohol polyoxyethylene ether sodium sulfate 3. Hollow glass microspheres 6, cyclohexane 20, n-propylamine 0.2, silane coupling agent KH550 0.6, deionized water in proper amount.
[0015] Described a kind of hollow glass microsphere enhances thermal conductivity polyurethane foam glue, is made by following specific steps:
[0016] (1) Pour trihydroxypolypropylene oxide ether, castor oil and glycerin into the reaction kettle, heat it in a constant temperature water bath to 85°C, stir and react at a speed of 150 rpm for 60 minutes, then coo...
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