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Fast-cured epoxy impregnating adhesive and preparation method thereof

An impregnating glue and epoxy technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of slow curing speed of impregnating glue, time required for early strength of impregnating glue, no obvious rigid requirements for basic performance, etc. To achieve the effect of good moisture and heat aging resistance and high reactivity

Active Publication Date: 2016-12-07
CARBON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional structural reinforcement projects have no obvious rigid requirements on the curing speed of the impregnating adhesive and the basic properties of the colloid in a short period of time. It is only required that the performance of the impregnating adhesive after curing for seven days meet the corresponding standard requirements. At present, most domestic products meet the standard requirements; In some emergency repair and reinforcement projects, due to the limitation of external conditions, it is bound to put forward high requirements on the curing performance of the impregnated adhesive, which often requires the impregnated adhesive to have good basic properties in a short period of time, while most of the domestic Conventional dipping glue products cannot meet the requirements, mainly as follows: the curing speed of the dipping glue is slow, and the early strength of the dipping glue takes a long time

Method used

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  • Fast-cured epoxy impregnating adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A fast-curing epoxy impregnating glue, which is composed of component A and component B at a ratio of 1:0.5 by weight. The components of component A are as follows: bisphenol A type epoxy 100 parts of resin, 0.5 parts of silane coupling agent, 1 part of thixotropic agent, the components of B component are as follows by weight: 100 parts of modified polyamine curing agent.

[0018] The epoxy value of the bisphenol A type epoxy resin is 0.48-0.54.

[0019] The modified polyamine curing agent is a modified polyamine curing agent that still has good curing ability at 5°C and has an active hydrogen equivalent of 100-160.

[0020] The silane coupling agent is selected from γ-aminopropyl triethoxysilane (KH-550), γ-glycidyl ether propyl triethoxysilane (KH-560), γ-propyltrimethoxysilane At least one of base silane (KH-570).

[0021] The present invention also provides a preparation method of fast-curing epoxy impregnating glue, comprising the steps of:

[0022] S1: Preparat...

Embodiment 2

[0026] A fast-curing epoxy impregnating glue, which is composed of component A and component B at a ratio of 1:0.6 by weight. The components of component A are as follows: bisphenol A type epoxy 100 parts of resin, 1 part of silane coupling agent, 3 parts of thixotropic agent, the components of component B are as follows by weight: 100 parts of modified polyamine curing agent.

[0027] The epoxy value of the bisphenol A type epoxy resin is 0.48-0.54.

[0028] The modified polyamine curing agent is a modified polyamine curing agent that still has good curing ability at 5°C and has an active hydrogen equivalent of 100-160.

[0029] The silane coupling agent is selected from γ-aminopropyl triethoxysilane (KH-550), γ-glycidyl ether propyl triethoxysilane (KH-560), γ-propyltrimethoxysilane At least one of base silane (KH-570).

[0030] The present invention also provides a preparation method of fast-curing epoxy impregnating glue, comprising the steps of:

[0031] S1: Preparatio...

Embodiment 3

[0035] A fast-curing epoxy impregnating glue, which is composed of component A and component B at a ratio of 1:0.7 by weight. The components of component A are as follows: bisphenol A type epoxy 100 parts of resin, 2 parts of silane coupling agent, 5 parts of thixotropic agent, the components of component B are as follows by weight: 100 parts of modified polyamine curing agent.

[0036] The epoxy value of the bisphenol A type epoxy resin is 0.48-0.54.

[0037] The modified polyamine curing agent is a modified polyamine curing agent that still has good curing ability at 5°C and has an active hydrogen equivalent of 100-160.

[0038] The silane coupling agent is selected from γ-aminopropyl triethoxysilane (KH-550), γ-glycidyl ether propyl triethoxysilane (KH-560), γ-propyltrimethoxysilane At least one of base silane (KH-570).

[0039] The present invention also provides a preparation method of fast-curing epoxy impregnating glue, comprising the steps of:

[0040] S1: Preparati...

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Abstract

The invention discloses a fast-cured epoxy impregnating adhesive. The fast-cured epoxy impregnating adhesive is composed of a component A and a component B at a weight ratio of 1: (0.5-0.7), wherein the component A comprises the following components in parts by weight: 100 parts of bisphenol A-type epoxy resin, 0.5-2 parts of a silane coupling agent and 1-5 parts of a thixotropic agent; the component B comprises the following component in parts by weight: 100 parts of a modified amine curing agent. The fast-cured epoxy impregnating adhesive overcomes the technical difficulties that in a fiber composite material repairing and reinforcing project, the conventional epoxy impregnating adhesive is low in curing speed and takes a long time for obtaining early strength. By matching with fiber cloth for use, the fast-cured epoxy impregnating adhesive provided by the invention can quickly repair and reinforce a base material. The fast-cured epoxy impregnating adhesive is high in reaction activity; after the fast-cured epoxy impregnating adhesive is cured for 4 h, a test shows that the tensile strength reaches 40 Mpa and the positive pulling bond strength reaches 2.56 Mpa, so that relevant requirements of GB50728 are met; the fast-cured epoxy impregnating adhesive is good in dampness resistance, heat resistance and aging resistance, and thus can be used for a long time.

Description

technical field [0001] The invention relates to the technical field of epoxy impregnating glue, in particular to a fast-curing epoxy impregnating glue and a preparation method thereof. Background technique [0002] In the reinforcement of engineering structures, fiber composite material reinforcement technology is a common reinforcement technology. Fiber composite material reinforcement technology usually uses matching adhesives to paste fiber cloth on the surface of the structure to play the role of structural reinforcement and seismic reinforcement. [0003] In the reinforcement technology of fiber composite materials, the adhesive is the link between the base material of the structure to be reinforced and the carbon fiber cloth. The impregnation effect of the impregnating adhesive on the base material and the carbon fiber cloth is good or bad, the curing performance of the impregnating adhesive is good or bad, and the strength of the bonding ability , often determines the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C08G59/50
CPCC08G59/50C08K5/5435C08K5/544C09J11/06C09J163/00
Inventor 周洪芝
Owner CARBON TECH CO LTD
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