Thermal-conductive insulating soybean-based plate adhesive and preparation method thereof

Abstract

The invention discloses a thermal-conductive insulating soybean-based plate adhesive which comprises the following raw materials in parts by weight: 0.6-1 part of butyltin trioctylate, 0.1-0.3 part of aluminum nitride, 0.5-1 part of lauryl dimethyl amine oxide, 2-4 parts of polyvinyl alcohol, 170-200 parts of defatted soybean powder, 0.3-0.4 part of ferric chloride, 0.1-0.2 part of ferrous chloride, 0.8-1 part of epichlorohydrin, 2-3 parts of N-hydroxymethyl acrylamide, 16-20 parts of styrene, 0.1-0.2 part of potassium persulfate, 3-4 parts of hemicellulase, 10-19 parts of polydiphenylmethane diisocyanate, 60-70 parts of 20-30 percent of hydrochloric acid solution, 3-4 parts of allyl polyethylene glycol, 0.7-1 part of acetylated lanolin, 2-3 parts of alkenyl succinic anhydride, 3-4 parts of microcrystalline wax, 1-2 parts of methylcellulose and 0.6-1 part of graphite powder. The thermal-conductive insulating soybean-based plate adhesive disclosed by the invention has the characteristics of being low in probability of equipment corrosion, free from formaldehyde, low in residual monomer content, friendly to environment, good in water resistance and the like.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a heat-conducting and insulating soybean substrate adhesive and a preparation method thereof. Background technique [0002] Aldehyde adhesives are used in the largest amount in wood industry adhesives, but they have many disadvantages: the main raw materials are mostly from non-renewable resources such as petroleum and coal; carcinogens (such as formaldehyde) are continuously emitted during production and use, which will harm the human body Healthy; the product is non-degradable and easy to pollute the environment. Therefore, the research and development of biomass-based adhesives to replace aldehyde-based adhesives has received global attention. Among various biomass materials, soybeans (including genetically modified soybeans) have the characteristics of large yield, low cost, and high plant protein content, and are good raw materials for adhesives; study soybean-based adhes...

AI Technical Summary

Problems solved by technology

[0002] Aldehyde adhesives are used in the largest amount in wood industry adhesives, but they have many disadvantages: the main raw materials are mostly from non-renewable resources such as petroleum and coal; carcinogens (such as formaldehyde) are continuously emitted during production and use, which will harm the human body Healthy; the product is non-degradable and easy to pollute the environment

[0005] The current research methods all focus on modifying the soybean protein in it, but do not involve 40% carbohydrates, causing this component to have no effect on the water resistance of the adhesive after curing, or even have a negative effect, and waste raw materials