Damp-heat-resistant soybean-based board adhesive and preparation method thereof
An adhesive, heat and humidity resistance technology, applied in the direction of adhesives, adhesive additives, adhesive types, etc., can solve the problems of adhesive water resistance not working, harmful to human health, non-degradable products, etc., which is not easy to achieve Equipment corrosion, low residual monomer content, low hydrophilic effect
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[0023] A heat-and-humidity-resistant soybean-based substrate adhesive, which is composed of the following raw materials in parts by weight:
[0024] Polymaleic anhydride 2, polyvinyl alcohol 2, defatted soybean flour 170, ferric chloride 0.3, ferrous chloride 0.1, epichlorohydrin 0.8, N methylol acrylamide 2, styrene 16, potassium persulfate 0.1, Hemicellulase 3, polydiphenylmethane diisocyanate 10, 20% hydrochloric acid solution 60, ethoxylated alkyl ammonium sulfate 0.6, palm wax 2, 2,2 dimethylol propionate 0.6, stannous octoate 0.01, divinylbenzene 0.01, zirconium oxychloride octahydrate 4, diatomaceous earth 2.
[0025] A preparation method of the described heat-and-humidity resistant soybean-based substrate adhesive comprises the following steps:
[0026] (1) Mix the above-mentioned ferric chloride and ferrous chloride, add to 20% hydrochloric acid solution, stir evenly to obtain ferric salt solution;
[0027] (2) Add the above-mentioned zirconium oxychloride octahydra...
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