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Damp-heat-resistant soybean-based board adhesive and preparation method thereof

An adhesive, heat and humidity resistance technology, applied in the direction of adhesives, adhesive additives, adhesive types, etc., can solve the problems of adhesive water resistance not working, harmful to human health, non-degradable products, etc., which is not easy to achieve Equipment corrosion, low residual monomer content, low hydrophilic effect

Inactive Publication Date: 2017-01-04
QUANJIAO HAIFENG PRINTING PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Aldehyde adhesives are used in the largest amount in wood industry adhesives, but they have many disadvantages: the main raw materials are mostly from non-renewable resources such as petroleum and coal; carcinogens (such as formaldehyde) are continuously emitted during production and use, which will harm the human body Healthy; the product is non-degradable and easy to pollute the environment
[0005] The current research methods all focus on modifying the soybean protein in it, but do not involve 40% carbohydrates, causing this component to have no effect on the water resistance of the adhesive after curing, or even have a negative effect, and waste raw materials

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0023] A heat-and-humidity-resistant soybean-based substrate adhesive, which is composed of the following raw materials in parts by weight:

[0024] Polymaleic anhydride 2, polyvinyl alcohol 2, defatted soybean flour 170, ferric chloride 0.3, ferrous chloride 0.1, epichlorohydrin 0.8, N methylol acrylamide 2, styrene 16, potassium persulfate 0.1, Hemicellulase 3, polydiphenylmethane diisocyanate 10, 20% hydrochloric acid solution 60, ethoxylated alkyl ammonium sulfate 0.6, palm wax 2, 2,2 dimethylol propionate 0.6, stannous octoate 0.01, divinylbenzene 0.01, zirconium oxychloride octahydrate 4, diatomaceous earth 2.

[0025] A preparation method of the described heat-and-humidity resistant soybean-based substrate adhesive comprises the following steps:

[0026] (1) Mix the above-mentioned ferric chloride and ferrous chloride, add to 20% hydrochloric acid solution, stir evenly to obtain ferric salt solution;

[0027] (2) Add the above-mentioned zirconium oxychloride octahydra...

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PUM

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Abstract

The invention discloses a damp-heat-resistant soybean-based board adhesive. The adhesive is prepared from, by weight, 2-3 parts of polymaleic anhydride, 2-4 parts of polyvinyl alcohol, 170-200 parts of defatted soybean powder, 0.3-0.4 part of ferric chloride, 0.1-0.2 part of ferrous chloride, 0.8-1 part of epoxy chloropropane, 2-3 parts of N-hydroxymethyl acrylamide, 16-20 parts of styrene, 0.1-0.2 part of potassium persulfate, 3-4 parts of hemicellulase, 10-19 parts of 4,4'-diphenylmethane diisocyanate, 60-70 parts of 20-30% hydrochloric acid solution, 0.6-1 part of ammonium alcohol ether sulphate, 2-4 parts of palm wax, 0.6-1 part of 2,2-dimethylolpropionic acid, 0.01-0.02 part of stannous octoate, 0.01-0.02 part of divinyl benzene, 4-6 parts of zirconium oxychloride octahydrate and the like. The adhesive has the advantages that equipment is not likely to be corroded, pot-life storage life is long, the adhesive is free of formaldehyde, the residual monomer content is low, and water resistance is good.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a heat-and-humidity resistant soybean substrate adhesive and a preparation method thereof. Background technique [0002] Aldehyde adhesives are used in the largest amount in wood industry adhesives, but they have many disadvantages: the main raw materials are mostly from non-renewable resources such as petroleum and coal; carcinogens (such as formaldehyde) are continuously emitted during production and use, which will harm the human body Healthy; the product is non-degradable and easy to pollute the environment. Therefore, the research and development of biomass-based adhesives to replace aldehyde-based adhesives has received global attention. Among various biomass materials, soybeans (including genetically modified soybeans) have the characteristics of large yield, low cost, and high plant protein content, and are good raw materials for adhesives; study soybean-based adhesive...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J151/00C09J11/04C09J11/06C09J11/08C08F289/00C08F220/58C08F285/00C08F212/08C08H1/00
CPCC09J151/00C08F285/00C08F289/00C08H1/00C08L2205/035C09J11/04C09J11/06C09J11/08
Inventor 毕全中
Owner QUANJIAO HAIFENG PRINTING PACKAGING
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