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High-temperature-resistant adhesion-resistant release film

A release film, high temperature resistant technology, applied in the field of release film, can solve the problems of mechanical properties not meeting the needs of the industry, poor heat sealing performance of the release film, lack of release film, etc., to achieve good thermal stability and Heat shrinkage rate, easy operation, diversified functions

Inactive Publication Date: 2016-12-07
JIXIANGBAO TAICANG RELEASE MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This kind of high temperature resistance adhesive release film is mainly used for FPC flexible circuit board lamination, but the existing release film has poor heat sealing performance, low thermal shrinkage rate, is not easy to recycle, and its mechanical properties cannot meet the needs of the industry.
[0005] In addition, the existing release films often do not have good temperature resistance, filling and separation properties, which greatly restricts their application in FPC flexible circuit boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A high temperature resistant adhesive release film, including a film layer, the film layer includes the following raw materials in weight ratio:

[0028] TPX: 105 parts, PP: 16 parts, 2-ethyl methacrylate: 6.8 parts, polyurethane: 3.2 parts, polyarylate: 2 parts, glass fiber: 3.5 parts, carbon fiber: 1.52 parts, organic montmorillonite: 1.9 Parts, ethylene glycol: 15 parts, silane coupling agent: 2.6 parts, antioxidant: 0.48 parts, light stabilizer: 0.54 parts, defoamer: 0.3 parts, thickener: 0.28 parts.

Embodiment 2

[0030] A high temperature resistant adhesive release film, including a film layer, the film layer includes the following raw materials in weight ratio:

[0031] TPX: 102 parts, PP: 12 parts, 2-ethyl methacrylate: 7 parts, polyurethane: 3.5 parts, polyarylate: 1.7 parts, glass fiber: 5 parts, carbon fiber: 1.1 parts, organic montmorillonite: 3 parts Parts, ethylene glycol: 12 parts, silane coupling agent: 2.2 parts, antioxidant: 0.2 parts, light stabilizer: 1 part, defoamer: 0.5 parts, thickener: 0.17 parts.

Embodiment 3

[0033] A high temperature resistant adhesive release film, including a film layer, the film layer includes the following raw materials in weight ratio:

[0034] TPX: 108 parts, PP: 20 parts, 2-ethyl methacrylate: 5 parts, polyurethane: 4 parts, polyarylate: 1.3 parts, glass fiber: 2.8 parts, carbon fiber: 1.65 parts, organic montmorillonite: 1 Parts, ethylene glycol: 10 parts, silane coupling agent: 2.8 parts, antioxidant: 0.6 parts, light stabilizer: 0.25 parts, defoamer: 0.15 parts, thickener: 0.4 parts.

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PUM

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Abstract

The invention provides a high-temperature-resistant adhesion-resistant release film which comprises a thin film layer. The thin film layer comprises the following raw materials in parts by weight: TPX, PP (polypropylene), ethyl 2-methacrylate, polyurethane, polyarylester, glass fibers, carbon fibers, organic montmorillonite, ethanediol, a silane coupling agent, an antioxidant, a light stabilizer, a defoaming agent and a thickener. The high-temperature-resistant adhesion-resistant release film has the advantages of smooth surface, favorable peel strength, favorable tensile strength, favorable filling property and favorable separability. The high-temperature-resistant adhesion-resistant release film has favorable temperature resistance and heat shrinkage rate, can resist photoaging, and can be used repeatedly. Besides, the high-temperature-resistant adhesion-resistant release film provided by the invention is environment-friendly and nontoxic. The synthesis method is simple, is convenient to operate and mild in conditions, and is suitable for industrial production.

Description

technical field [0001] The invention relates to a release film, in particular to a high temperature resistant adhesive release film. Background technique [0002] Release film, also known as peeling film, isolation film, separation film, barrier film, release film, film, plastic film, hole masking film, silicone oil film, silicone oil paper, anti-adhesive film, slip film, Tianna paper, release film Paper, silliconfilm, release film, release. Usually, in order to increase the release force of the plastic film, the plastic film will be treated with plasma, or coated with fluorine, or coated with silicon (silicone) release agent on the surface of the film material, such as PET, PE, OPP, etc.; It can show extremely light and stable release force for various organic pressure-sensitive adhesives (such as hot-melt adhesives, acrylic adhesives and rubber-based pressure-sensitive adhesives). [0003] Because the release film has the advantages of isolation, filling, protection, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/20C08L23/12C08L75/04C08K13/06C08K9/04C08K3/34C08K7/14C08K7/06
CPCC08L23/20C08J5/18C08J2323/20C08J2423/12C08L2201/08C08L2203/16C08L2205/035C08L23/12C08L75/04C08K13/06C08K9/04C08K3/346C08K7/14C08K7/06
Inventor 於险峰
Owner JIXIANGBAO TAICANG RELEASE MATERIAL TECH CO LTD
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